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Whole-process production workstation for IC chips or MEMS devices

A workstation, full-process technology, applied in the direction of comprehensive factory control, instrumentation, program control, etc., can solve the problem of high production cost of IC chips and MEMS devices, and reduce plant occupation and maintenance area, reduce costs, and reduce production. cost effect

Inactive Publication Date: 2016-03-09
XINFOO SENSOR TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Expensive production equipment, construction and maintenance of large-scale dust-free workshops determine that the construction of an overall production line requires an investment of hundreds of millions to more than one billion, resulting in high production costs for IC chips and MEMS devices

Method used

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  • Whole-process production workstation for IC chips or MEMS devices
  • Whole-process production workstation for IC chips or MEMS devices
  • Whole-process production workstation for IC chips or MEMS devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Example 1: see figure 1 , is a full-process production workstation that can be applied to the production, testing and analysis of IC chips and MEMS devices. The workstation is single-layer and linear, mainly including:

[0023] The dust-free man-machine exchange chamber 10 is used to manually pick and place workpieces and control the operation of workstations. The workpieces can be raw materials, semi-finished products or finished products of IC chips or MEMS devices.

[0024] The intelligent transmission chamber 20 is connected between the man-machine exchange chamber and the process flow chamber or between the process flow chambers, and is used for transporting workpieces. In this embodiment, the intelligent transmission chamber is a horizontal intelligent transmission chamber 21 .

[0025] The process chamber 30 is arranged on the transmission line of the intelligent transmission chamber 20, and is composed of a central transportation chamber 31 and a plurality of sa...

Embodiment 2

[0029] Example 2: see figure 2 , and the difference with Embodiment 1 is that: the whole process production workstation of this embodiment is single-layer and circular. In the whole workstation, there are two-star cavity, three-star cavity, four-star cavity and five-star cavity, which are connected by horizontal intelligent transmission cavity. The intelligent transmission chamber between the man-machine exchange chamber and the process chamber is transferred to the first process chamber through the conveyor belt, and the intelligent transmission chamber between the process chambers is completed by the manipulator or robot in the process chamber Pick and place the workpiece to realize the transmission. In the man-machine exchange chamber 10, raw materials and trays are manually put into the input window 41, and then enter the output window 42 of the man-machine exchange chamber through a series of processing in the process chamber 30 and transmission in the horizontal intell...

Embodiment 3

[0030] Embodiment 3: see image 3 , Different from Embodiments 1 and 2, the workstation described in this embodiment is designed as a multi-layer structure, specifically the upper and lower 3-layer workrooms. Among them, the human-machine exchange chamber 10 and the intelligent control mechanism 11 are arranged in the first-floor workshop, which is convenient for manual operation; the process flow chamber 30 is respectively arranged in the first, second, and third-floor workshops. The inner process flow chamber is designed as the linear structure in embodiment 1, of course, it can also be designed as the circular structure in embodiment 2. The workpiece transmission in the same layer is realized through the horizontal intelligent transmission chamber 21 , while the workpiece transmission between layers is realized through the upper and lower intelligent transmission chambers 22 .

[0031] see Figure 4 , is the upper and lower intelligent transmission mechanism in the upper ...

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Abstract

The invention provides a whole-process production workstation for IC chips or MEMS devices, comprising a dust-free man-machine exchange cavity which is used for picking and placing work pieces manually and controlling operation of the workstation, an intelligent transmission cavity which is used for transmitting work pieces to technological process cavities, and one or more technological process cavities which are arranged on the transmission line of the intelligent transmission cavity and are each composed of a center transportation cavity and multiple satellite cavities arranged around the center transportation cavity. The center transportation cavities are connected with the intelligent transmission cavity, and are each internally equipped with automatic grabbing equipment capable of picking work pieces from the satellite cavities and placing work pieces in the satellite cavities. The satellite cavities can complete set work piece production technological processes. The working environment in and the operation sequence of the intelligent transmission cavity, the center transportation cavities and the satellite cavities are systematically controlled by an intelligent control mechanism arranged in the man-machine exchange cavity. The workstation is designed into a multilayer structure, so that the occupied area and maintenance cost of the equipment is reduced to a great extent, the production efficiency is improved, and the production cost of IC chips or MEMS devices is reduced fundamentally.

Description

technical field [0001] The invention relates to a production equipment for manufacturing integrated circuit (IC) chips or microelectromechanical system (MEMS) devices, in particular to a full-process production workstation that can be used for IC chips or MEMS devices. Background technique [0002] As we all know, the production of integrated circuits (IC) and MEMS devices is a high-investment, high-tech, high-risk, high-yield industry. There are many technological processes and production equipment involved in the production of IC chips and MEMS devices. These production equipment are placed in the "clean room" of thousands to tens of thousands of square meters, requiring dozens to hundreds of high-quality professionals. personnel to operate and maintain it. Expensive production equipment, construction and maintenance of large-scale dust-free workshops determine that the construction of an overall production line requires an investment of hundreds of millions to billions, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/418
CPCG05B19/41805G05B2219/32084
Inventor 赵照
Owner XINFOO SENSOR TECH CO LTD
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