Preparation method of non-bending ultrafine tungsten wire for z-pinch quasi-spherical wire array

Abstract

The invention discloses a preparing method for non-bending ultrathin tungsten wires for a Z-pinch torispherical wire array. The diameter of the ultrathin tungsten wires ranges from four micrometers to ten micrometers, and no bending phenomenon exists in the centimeter magnitude range. The method comprises the following steps that raw material wires are subjected to hot drawing to enable the diameter to be controlled within the range larger than or equal to 16 micrometers; a multi-pass electrolytic etching technology is carried out, a limit single-pass diameter reducing method is adopted to enable the ultrathin tungsten wires obtained after continuous electrochemical corrosion to keep the mechanical property under the condition that the bending span is slightly increased; and in annealing heat treatment, the finished tungsten wires are rewound on a quartz glass tube to be placed in a heat treatment furnace so as to be heated to 480 DEG C and conduct heat preservation for 10 minutes, the tungsten wires are cooled along with cooling of the furnace, in the period, the quartz glass tube is vacuumized, high-purity argon or high-purity nitrogen is injected in to serve as protection gas, and the finished tungsten wires are recrystallized, but the breaking strength is not obviously reduced. Compared with the traditional technology, the ultrathin tungsten wires manufactured with the preparing method have the beneficial effects that no obvious bending exists in the free state, and the breaking strength is better.

Description

technical field [0001] The invention belongs to the fields of ultra-fine tungsten wire processing technology and Z-pinch target material preparation, and in particular relates to a preparation method of non-bending ultra-fine tungsten wire used for Z-pinch quasi-spherical wire arrays. Background technique [0002] The physical conception of inertial confinement fusion (ICF) driven by strong X-ray radiation generated by fast plasma pinch (Z-pinch) to drive DT fuel capsule implosion is considered to be a simple, efficient and technically feasible new way of fusion energy. In Z-pinch experimental research, in order to obtain high X-ray yield, the initial radius and wire quality of the wire array load must be optimized. Ultra-fine tungsten wire (usually 3 μm ~ 10 μm in diameter) is the most commonly used wire array target material, and the diameter parameters, straightness and mechanical performance parameters of tungsten wire are important technical indicators for tungsten wire...

AI Technical Summary

Problems solved by technology

[0006] Although the drawing method combined with electrochemical corrosion is widely used in the industry to prepare ultra-fine tungsten wires, the bending phenomenon of tungsten wires is not paid attention to, and the breaking strength of Φ6μm tungsten wires produced by industrial methods is lower than 2800MPa

This strength is slightly higher than the strength that the tungsten wire needs to withstand when forming a quasi-spherical wire array. However, if the tungsten wire produced by the traditional process is annealed, its strength will be further reduced, which makes it difficult to meet the forming requirements of the Z-pinch quasi-spherical wire array.

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