Two-phase-flow atomized-spray washing device and two-phase-flow atomized-spray washing method

Abstract

The invention discloses a two-phase-flow atomized-spray washing device and a two-phase-flow atomized-spray washing method. A plurality of liquid branching pipelines provided with liquid guide outlets with a preset angle, and an air discharging screen plate provided with a vertical air guide outlet are arranged inside a nozzle main body, so that ejected high-speed liquid flow and high-speed air flow interact fully to form ultra-micro atomized liquid drops which are uniform and adjustable in particle size; under the acceleration and guidance effect of an atomized particle guide outlet, the ultra-micro atomized liquid drops are downwards ejected towards a wafer surface to realize mobile atomization washing. The device and the method disclosed by the invention are capable of greatly reducing the size of atomized particles and reducing energy of the atomized particles, so that damages of a graphic structure of the wafer surface can be prevented, the washing quality and washing efficiency can be improved, and the washing cost can be lowered.

Description

technical field [0001] The present invention relates to the technical field of semiconductor cleaning equipment, and more specifically, to a two-phase flow atomization jet cleaning device and a cleaning method. Background technique [0002] With the rapid development of semiconductor integrated circuit manufacturing technology, the graphic feature size of integrated circuit chips has entered the deep sub-micron stage, and the feature size of key contaminants (such as particles) that cause failure or damage to ultra-fine circuits on the chip has also increased. greatly reduced. [0003] During the manufacturing process of integrated circuits, semiconductor wafers usually go through multiple process steps such as film deposition, etching, and polishing. And these process steps just become the important place that the contamination produces. In order to maintain the clean state of the wafer surface and eliminate the contaminants deposited on the wafer surface during each proc...

AI Technical Summary

Problems solved by technology

[0007] However, the size of the atomized particles produced by the current common atomization cleaning devices is relatively large, and the energy of the atomized particles is also high. When it is medium, it is easy to cause problems such as surface graphics damage

At the same time, the utilization rate of liquid phase fluid is low, resulting in an extreme waste of resources

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