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UV-curable halogen-free flame-retardant low-shrinkage epoxy resin composition and preparation method thereof

A technology of shrinking epoxy resin and epoxy resin, which is applied in the field of halogen-free flame-retardant low-shrinkage epoxy resin composition, can solve the problems of large curing shrinkage rate and flammability, and achieve dimensional stability, low shrinkage rate, and mechanical properties good effect

Active Publication Date: 2018-01-16
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The present invention aims at the existing problems of large curing shrinkage rate and flammability of the existing UV-curable epoxy resin composition, and provides a UV-curable halogen-free flame-retardant low-shrinkage epoxy resin composition and a preparation method thereof

Method used

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  • UV-curable halogen-free flame-retardant low-shrinkage epoxy resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 56g phosphorus-containing flame retardant epoxy resin prepolymer DOPOER-2.3%, 10g phenyl glycidyl ether, 10g ethylene glycol diglycidyl ether, 20g 3,9-diethyl-3,9-dipropylene oxide Base-1,5,7,11-tetraoxaspiro[5,5]undecane and 4g triphenylsulfonium hexafluoroantimonate were stirred evenly at a speed of 300r / min to obtain UV-curable halogen-free resist Burn low-shrinkage epoxy resin composition, keep away from light.

Embodiment 2

[0027] 56g phosphorus-containing flame retardant epoxy resin prepolymer DOPOER-2.3%, 15g phenyl glycidyl ether, 15g ethylene glycol diglycidyl ether, 10g 3,9-diethyl-3,9-dimethylol ‐1,5,7,11‐tetraoxaspiro[5,5]undecane and 4g triphenylsulfonium hexafluoroantimonate were stirred evenly at a speed of 300r / min to obtain UV-curable halogen-free flame retardant Low shrinkage epoxy resin composition, keep away from light.

Embodiment 3

[0029]61g phosphorus-containing flame retardant epoxy resin prepolymer DOPOER-2.0%, 10g phenyl glycidyl ether, 12g glycerol triglycidyl ether, 15g 3,9-diethyl-3,9-dipropylene oxide Base‐1,5,7,11‐tetraoxaspiro[5,5]undecane and 2g of 4‐methyl‐4'‐isobutyldiphenyliodonium hexafluorophosphate were stirred at a speed of 300r / min Uniform UV-curable halogen-free flame-retardant low-shrinkage epoxy resin composition can be obtained and stored away from light.

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Abstract

The invention discloses a UV-curing halogen-free flame-retardant low-shrinkage epoxy resin composition and a preparation method thereof. The composition is prepared from, by mass, 50%-70% of phosphorus-containing flame-retardant epoxy resin prepolymer, 11% -30% of active diluents, 5%-20% of spirocyclic monomers and 2%-4% of positive ion photoinitiator. The preparation method of the phosphorus-containing flame-retardant epoxy resin prepolymer includes the steps of mixing epoxy resin E-51 with 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxider, and raising the temperature to enable the mixture to be reacted to prepare the prepolymer. According to the composition and the preparation method thereof, the product is not only high in flame-retardant efficiency, but also small in effect on mechanical performance of epoxy resin; when the content of phosphorus is 1.3%, the cured product LOI reaches 34%, vertical combustion passes through UL 94V-0 level, curing can be performed rapidly under irradiation of UV, the volume shrinkage rate is quite low in the curing forming process, and even zero shrinkage can be reached.

Description

technical field [0001] The invention relates to a halogen-free flame-retardant low-shrinkage epoxy resin composition, in particular to an ultraviolet-cured halogen-free flame-retardant low-shrinkage epoxy resin composition and a preparation method thereof. The epoxy resin composition has the advantages of low curing shrinkage, excellent flame retardancy, good mechanical properties, etc., and can meet the requirements of light-curing rapid prototyping resins. Background technique [0002] Epoxy resin is a kind of widely used resin, which is formed by polymerization through the ring-opening reaction of epoxy groups. It has the advantages of anaerobic polymerization inhibition, high molding and curing rate, and good mechanical properties. UV curing technology uses liquid photosensitive resin to initiate polymerization reaction under the irradiation of ultraviolet light and quickly solidifies to form high molecular polymer. It has the advantages of economy, wide applicability, e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/30C08G59/40
CPCC08G59/304C08G59/4007
Inventor 刘述梅郑展平赵建青袁彦超蒋智杰赵颖
Owner SOUTH CHINA UNIV OF TECH
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