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An electronic component and its manufacturing method

A technology of electronic components and manufacturing methods, applied in the direction of electrical components, inductance/transformer/magnet manufacturing, transformer/inductance parts, etc., can solve problems such as low strength, poor reliability, porcelain body or electrode defects, and prevent cracking , to ensure compactness and reduce internal defects

Active Publication Date: 2017-08-25
SUNLORD (SHANGHAI) ELECTRONICS CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the conductive electrode and the substrate belong to metal and non-metal materials respectively, there is a big difference in the sintering shrinkage process of the two materials during the firing process, and the two materials are in the low-strength stage before reaching the firing temperature. When subjected to stresses caused by differences in the shrinkage process, defects in the ceramic body or electrodes lead to poor reliability

Method used

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  • An electronic component and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0068] Using the above-mentioned electronic component manufacturing method to make a chip common mode inductor in a metric 0806 package includes the following steps:

[0069] 1) Make electrodes on the alumina substrate 101

[0070] 1.1) Prepare alumina substrate

[0071] Purchase Chaozhou Sanhuan 99 alumina substrate.

[0072] 1.2) Making electrodes

[0073] 1.2.1) Equipped with electrode paste: ML-SP19 silver paste produced by Shoei Chemical Company, with a volume resistivity of 0.022mm*ohm.

[0074] 1.2.2) Use screen printing equipment to coat the electrode slurry on the surface of the alumina substrate to obtain the electrode raw material layer. The thickness of the electrode raw material layer is 10 μm to 12 μm, and the line width of the electrode raw material layer is 40 to 45 μm .

[0075] 2) Firing the electrode raw material layer

[0076] The alumina substrate 101 with the electrode raw material layer is sintered in a box-type sintering furnace (Nabertherm box fur...

example 2

[0093] Using the above-mentioned electronic component manufacturing method to manufacture a metric 0605 package chip common mode inductor, the manufacturing process is compared with Embodiment 1, the difference is that:

[0094] In step 1.2.1), the electrode paste is NP-4940 silver paste produced by Noritake, and the volume resistivity is 0.023mm*ohm.

[0095] In step 1.2.2), an electrode slurry layer is fabricated on the surface of the alumina substrate by photolithography, and the line width of the electrode slurry layer is 20-30 μm.

[0096] Comparison with Existing Processes

[0097] The metric 0605 package chip common mode inductor prepared by Example 2 of the present invention, the length L of the long and wide sides is designed according to 30 μm, and the inside of the green body after lamination molding is scanned by SEM without cracking, and the ceramic body after sintering No cracks, no cracks on the surface of electronic components. The reliability test of 1000h c...

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Abstract

The invention discloses an electronic element and a production method thereof. The production method comprises the following steps: S1, forming an electrode raw material layer on a substrate, wherein the substrate is a sintered aluminum oxide substrate or zirconia substrate; S2, sintering the substrate to which the electrode raw material layer is attached, so that electrodes made of the electrode raw material layer are formed; S3, transferring the electrodes onto a thin film raw material sheet; and S4, lapping a plurality of layers of thin film raw material sheets to which electrodes are attached to obtain a blank body, and sintering the blank body. The electrodes and porcelain bodies in the electronic element are low in cracking possibility.

Description

[0001] 【Technical field】 [0002] The invention relates to an electronic component and a manufacturing method thereof. [0003] 【Background technique】 [0004] In the traditional lamination molding process, the substrate with conductive electrodes is directly laminated to bond the upper and lower substrates together to form a green body, and then the green body and electrodes are co-fired. Since the conductive electrode and the substrate belong to metal and non-metal materials respectively, there is a big difference in the sintering shrinkage process of the two materials during the firing process, and the two materials are in the low-strength stage before reaching the firing temperature. When subjected to stresses caused by differences in the shrinkage process, the ceramic body or electrodes can develop defects resulting in poor reliability. [0005] 【Content of invention】 [0006] In order to overcome the deficiencies of the prior art, the invention provides a method for man...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/28H01F17/00H01F27/29H01F41/02
CPCH01F17/0013H01F27/2804H01F27/292H01F41/0233H01F2027/295
Inventor 郑卫卫余瑞麟戴春雷
Owner SUNLORD (SHANGHAI) ELECTRONICS CO