A kind of preparation method of low temperature fast curing epoxy resin adhesive

An epoxy resin, fast curing technology, used in epoxy resin adhesives, adhesives, chemical instruments and methods, etc., can solve problems such as low temperature curing embrittlement, improve compatibility, improve bonding strength, and increase interface bonding force effect

Active Publication Date: 2018-06-26
平顶山鑫晟新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, high-temperature-resistant epoxy resin adhesives have appeared, but for low-temperature applications, most of them will have the problem of low-temperature curing embrittlement. How to effectively combine the mechanical properties of the adhesive with flexibility and thermal shock resistance is a need. Highlights of the study

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A preparation method for low temperature fast curing epoxy resin adhesive, comprising the following steps:

[0023] Step 1. ReO 3 The powder is placed in a mixer preheated to 120°C, and during the process of mixing and stirring, add a weight of ReO 3 Powder weight 8% silane coupling agent, react for 30min, lower the temperature inside the mixer to 70°C, add ReO 3 The nitrile rubber of 110 times of powder weight, stirs 50min, makes modified nitrile rubber, for subsequent use;

[0024] Step 2: Take 20ml of silane coupling agent, and then dissolve it in 980ml of ethanol to make a silane coupling agent / ethanol solution with a volume concentration of 2%, then weigh 300g of glass fiber, and place it in the silane coupling agent Soak in / ethanol solution for 12 hours, dry in an oven at 80°C after drying to obtain modified glass fibers, and set aside;

[0025] Step 3: Take silicon carbide, the ratio of its volume to the total weight of silicon carbide is 50mL: after mixing 1...

Embodiment 2

[0030] A preparation method for low temperature fast curing epoxy resin adhesive, comprising the following steps:

[0031] Step 1. ReO 3 The powder is placed in a mixer preheated to 90°C, and during the process of mixing and stirring, add a weight of ReO 3 3% silane coupling agent by powder weight, react for 30min, lower the temperature inside the mixer to 55°C, add ReO 3 The nitrile rubber of 110 times of powder weight, stirs 30min, makes modified nitrile rubber, for subsequent use;

[0032] Step 2: Take 20ml of silane coupling agent, and then dissolve it in 980ml of ethanol to make a silane coupling agent / ethanol solution with a volume concentration of 2%, then weigh 300g of glass fiber, and place it in the silane coupling agent Soak in / ethanol solution for 12 hours, dry in an oven at 80°C after drying to obtain modified glass fibers, and set aside;

[0033] Step 3: Take silicon carbide, the ratio of its volume to the total weight of silicon carbide is 50mL: after mixing 1...

Embodiment 3

[0038] A preparation method for low temperature fast curing epoxy resin adhesive, comprising the following steps:

[0039] Step 1. ReO 3 The powder is placed in a mixer preheated to 110°C, and during the process of mixing and stirring, add a weight of ReO 3 Powder weight 6% silane coupling agent, react for 30min, lower the temperature inside the mixer to 60°C, add ReO 3 The nitrile rubber of 110 times of powder weight, stirs 45min, makes modified nitrile rubber, for subsequent use;

[0040] Step 2: Take 20ml of silane coupling agent, and then dissolve it in 980ml of ethanol to make a silane coupling agent / ethanol solution with a volume concentration of 2%, then weigh 300g of glass fiber, and place it in the silane coupling agent Soak in / ethanol solution for 12 hours, dry in an oven at 80°C after drying to obtain modified glass fibers, and set aside;

[0041] Step 3: Take silicon carbide, the ratio of its volume to the total weight of silicon carbide is 50mL: after mixing 1...

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Abstract

The invention discloses a low-temperature fast-curing epoxy resin adhesive and a preparation method thereof. The low-temperature fast-curing epoxy resin adhesive is prepared from 30%-60% of epoxy resin, 10%-20% of organic silicon resin, 6%-8.5% of modified nitrile rubber, 2%-4.5% of a catalyst, 2%-3% of a curing agent, 2%-3% of a flexibilizer, 16%-21% of inorganic filler and 2%-10% of modified filler. The inorganic filler comprises nano-montmorillonite, nano SiO2 and copper powder in the weight ratio being (5-10): (5-10): (8-11), and the modified filler comprises modified glass fiber and modified silicon carbide in the weight ratio being 7:3. The prepared epoxy resin adhesive can be used at the temperature of 30 DEG C and can be rapidly cured, the shearing strength reaches 30 MPa at the temperature of 15 DEG C, and the peeling strength reaches 8 kN / M at the temperature of 15 DEG C.

Description

technical field [0001] The invention relates to an epoxy resin adhesive, in particular to a preparation method of a low-temperature fast-curing epoxy resin adhesive. Background technique [0002] Among many types of adhesives, epoxy resin adhesives are favored for their strong bonding ability and wide adaptability. Epoxy resin adhesives are an important class of engineering adhesives. With the advancement of science and technology, especially the development of cutting-edge technology, the requirements for adhesives are getting higher and higher. In the prior art, high-temperature-resistant epoxy resin adhesives have appeared, but for their low-temperature applications, most of them will have the problem of low-temperature curing embrittlement. How to effectively combine the mechanical properties of the adhesive with flexibility and thermal shock resistance is a need. The main content of the research. Contents of the invention [0003] The object of the present invention...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J183/04C09J109/02C09J11/04C09J11/06C09C3/12C09C3/06C09C1/28
Inventor 王丙欣王军见王红垒
Owner 平顶山鑫晟新材料有限公司
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