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UV adhesive for sealing quantum dot material, and preparation method thereof

A technology of quantum dot material and parts by weight, which is applied in the field of sealants, can solve the problems of low bond strength and poor water and oxygen barrier performance of sealants, and achieve the effects of comprehensive performance improvement, low shrinkage adhesion, and fast speed

Active Publication Date: 2016-03-30
DONGGUAN POWERBOND NEW MATERIALS TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to address the deficiencies of the prior art, to provide a UV glue for quantum dot material sealing, which can solve the problems of poor water and oxygen barrier performance and low bonding strength of the existing sealant

Method used

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  • UV adhesive for sealing quantum dot material, and preparation method thereof
  • UV adhesive for sealing quantum dot material, and preparation method thereof
  • UV adhesive for sealing quantum dot material, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Embodiment 1: The UV glue used for quantum dot material sealing provided by the present embodiment is prepared by the following components in parts by weight:

[0036]

[0037]

[0038] Wherein, the organosilicon segmented urethane acrylate is a modified polyurethane resin with a polysiloxane segment as the main chain and a methacrylate double bond functional group as an end group; the organosilicon-modified epoxy resin is The polysiloxane segment is the main chain, and the epoxy functional group is the modified silicone resin.

[0039] The polysiloxane is phenyl silicone oil containing active hydrogen end groups, methyl vinyl silicone oil, methyl ethoxy silicone oil, methyl silicone oil or ethyl silicone oil.

[0040]The reactive diluent contains a monofunctional or bifunctional monomer of methacrylate double bond functional group, wherein: the monofunctional group containing methacrylate double bond functional group is isooctyl acrylate, lauryl methacrylate, met...

Embodiment 2

[0053] Embodiment 2: the UV glue used for quantum dot material sealing provided by this embodiment, and the preparation method of this UV glue, its components and steps are basically the same as Example 1, and its difference is:

[0054] A kind of UV glue that is used for quantum dot material sealing, it is prepared by mixing the following components by weight:

[0055]

[0056]

[0057] A kind of preparation method of the UV glue that is used for quantum dot material sealing, it comprises the following steps:

[0058] (1) preparing organosilicon segmented urethane acrylate;

[0059] (2) prepare organosilicon modified epoxy resin;

[0060] (3) prepare each component by following parts by weight:

[0061]

[0062] (4) prepare a planetary vacuum mixer, the organosilicon segment polyurethane acrylate prepared in step (3), organosilicon modified epoxy resin, isobornyl acrylate, hydroxyethyl acrylate, 1-hydroxycyclohexyl Phenyl ketone, TEGO Airex931, 2,6-bis(octadecyl)-...

Embodiment 3

[0066] Embodiment 3: the UV glue used for quantum dot material sealing provided by this embodiment, and the preparation method of this UV glue, its components and steps are basically the same as those in Examples 1 and 2, except that:

[0067] A kind of UV glue that is used for quantum dot material sealing, it is prepared by mixing the following components by weight:

[0068]

[0069] A kind of preparation method of the UV glue that is used for quantum dot material sealing, it comprises the following steps:

[0070] (1) preparing organosilicon segmented urethane acrylate;

[0071] (2) prepare organosilicon modified epoxy resin;

[0072] (3) prepare each component by following parts by weight:

[0073]

[0074] (4) prepare a planetary vacuum mixer, the organosilicon segment polyurethane acrylate prepared in the step (3), organosilicon modified epoxy resin, lauryl methacrylate, methacrylate hydroxypropyl ester, 2 , 4,6-trimethylbenzoyl-diphenylphosphine oxide, BYK-320, ...

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Abstract

The invention discloses a UV adhesive for sealing a quantum dot material. The UV adhesive is prepared through mixing, by weight, 20-70 parts of organosilicon chain segment polyurethane acrylate, 5-40 parts of organosilicon modified epoxy resin, 10-40 parts of an active diluent, 0.3-5 parts of a photoinitiator and 1-5 parts of an assistant, wherein the organosilicon chain segment polyurethane acrylate is modified polyurethane resin adopting a polysiloxane chain segment as a main chain and a methacrylate double bond function group as an end group; and the organosilicon modified epoxy resin is modified organosilicon resin adopting a polysiloxane chain segment as a main chain and an epoxy function group as an end group. Main resin is based on organosilicon, and the structure and the molecular weight of the resin are controlled, so the UV adhesive has excellent water and oxygen barrier performances, and the problem of poor water and oxygen barrier performances of traditional sealing materials is solved.

Description

technical field [0001] The invention relates to the field of sealants, in particular to a UV glue used for sealing quantum dot materials and a preparation method for the UV glue. Background technique [0002] Combining quantum dot display materials with LED backlight modules can improve the color gamut of the display and obtain better display effects. This new technology has already begun to be used in products such as LCD TVs, tablet computers and mobile phones. The key to the technology is to add a layer of quantum dot film between the LCD and the backlight module, and convert a part of the blue light of the blue LED backlight into red light and green light through the light conversion performance of the quantum dot material. Compared with the white light emitted by traditional LEDs, more pure red light and green light can be obtained, so the display is brighter and the colors are richer, and the color gamut of the display can be increased from 70% NTSC to 110% NTSC. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/16C09J183/06
CPCC08L2205/03C09J175/16C09J183/06C08L83/06C08L75/16
Inventor 黄战光吴博舒小辉刘兆辉
Owner DONGGUAN POWERBOND NEW MATERIALS TECH DEV
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