Method for efficiently making large-depth-diameter-ratio micropore arrays

Abstract

The invention relates to a method for efficiently machining large-depth-diameter-ratio micropore arrays through a femtosecond laser Bessel beam, and belongs to the technical field of femtosecond laser application. According to the method, a femtosecond laser space light shaping method and a flight time punching method are integrated, the properties of small spot diameter and long focal depth of the femtosecond laser Bessel beam are effectively utilized, and a large area of large-depth-diameter-ratio micropore arrays can be efficiently machined within a short time. The depth-diameter ratio of the zero-taper micropores continuously machined under the single laser pulse condition reaches up to 330:1, the machining quality and machining efficiency of the micropore arrays are greatly improved, and the method has crucial application value in optics, optical instruments, aviation, biomedicine and the like.

Description

technical field [0001] The invention relates to a method for processing a microhole array with a high depth-to-diameter ratio, in particular to a method for efficiently processing a microhole array with a high depth-to-diameter ratio by using a femtosecond laser Bessel beam, and belongs to the technical field of femtosecond laser applications. Background technique [0002] Micropore manufacturing has extremely important applications in aerospace, optoelectronics, microfluidic devices and other related fields. With the continuous progress and development of laser technology, research on micropore manufacturing has very important practical significance. The advantage of laser microhole manufacturing is that it has better flexibility and higher degree of automation. In addition, compared with traditional mechanical processing technology, laser microhole manufacturing technology is a non-contact technology, and the processing tools will not be affected by the hardness of the proc...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the processing efficiency of high-quality, high-depth-diameter ratio microhole arrays is low, and it is impossible to quickly process large-area high-depth-diameter ratio microhole arrays in a relatively short period of time. A method for efficiently processing microhole arrays with a high depth-to-diameter

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