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Ceramic substrate and preparation method thereof, and power module

A technology of ceramic substrate and ceramic slurry, applied in ceramic layered products, chemical instruments and methods, layered products, etc., can solve the problems of high cost, application limitation, large thermal resistance, etc., and achieve high density and high strength. and the effect of toughness

Active Publication Date: 2016-04-06
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention solves the technical problems of high cost, large thermal resistance and strong toxicity of ceramics commonly used in DBC substrates in the prior art, which greatly restricts its application, and provides a new type of ceramic substrate

Method used

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  • Ceramic substrate and preparation method thereof, and power module
  • Ceramic substrate and preparation method thereof, and power module
  • Ceramic substrate and preparation method thereof, and power module

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] The present invention also provides a method for preparing the ceramic substrate, which includes the following steps: tape-casting to prepare the green body of the core layer, the green body of the upper transition layer, the green body of the lower transition layer, the green body of the upper surface layer and the green body of the lower surface layer; The order of upper surface layer-upper transition layer-core layer-lower transition layer-lower surface layer is to stack each green body successively, and after isostatic pressing, glue is discharged and sintered to obtain the ceramic substrate.

[0031] In the present invention, the method used to prepare the green body is tape casting, and the equipment and process conditions of the tape casting are well known to those skilled in the art. ceramic paste.

[0032] Specifically, the materials of the core layer and the transition layer of the ceramic substrate are both zirconia toughened alumina, therefore, the core laye...

Embodiment 1

[0045] (1) Preparation of ceramic slurry

[0046] Weigh Al according to the composition in Table 2 2 o 3 The required components of the slurry, ball mill ceramic powder, solvent and dispersant in a planetary ball mill for 4 hours, then add binder and plasticizer, ball mill for another 8 hours, add defoaming agent, finally ball mill for 1 hour, vacuum degassing for 0.5 hours h, that is, to get Al 2 o 3 slurry.

[0047] Weigh the required components of the ZTA10 slurry according to the components in Table 2, ball mill the ceramic powder, solvent and dispersant in a planetary ball mill for 4 hours, then add binder and plasticizer, ball mill for another 8 hours, and add defoaming agent agent, and finally ball milled for 1 hour, vacuum defoaming for 0.5 hours, and the ZTA10 slurry was obtained.

[0048] Weigh the required components of the ZTA10 slurry according to the components in Table 2, ball mill the ceramic powder, solvent and dispersant in a planetary ball mill for 4 ho...

Embodiment 2

[0055] Prepare ceramic slurry and ceramic green body according to the same method as in Example 1, and then prepare ceramic substrate S2 according to the following steps:

[0056] Cut the green body prepared in step (2) into 200mm×150mm, and then follow the green body Al 2 o 3 -Green ZTA10-Green ZTA20-Green ZTA10-Green Al 2 o3 Stack 5 layers of ceramic green bodies together in the following order; press the stacked ceramic green bodies with a warm water isostatic press, set the parameters of the warm water isostatic press at 85°C, and hold the pressure at 30MPa for 20min.

[0057] Finally, the pressed ceramic green body is put into a muffle furnace for debinding and sintering at one time. The debinding procedure is as follows: the temperature is raised from room temperature to 600°C at a rate of 0.5°C / min, and from room temperature to 600°C at a rate of 3°C / min. Raise the temperature from 600°C to 1600°C, hold at 1600°C for 3 hours, then cool down to 600°C at a rate of 8°C / m...

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Abstract

The invention provides a ceramic substrate and a preparation method thereof. The ceramic substrate comprises, from interior to exterior, a core layer, transition layers and surface layers in an integrated structure, wherein the transition layers comprise an upper transition layer and a lower transition layer symmetrically distributed at two sides of the core layer, the surface layers comprise an upper surface layer and a lower surface layer symmetrically distributed at two sides of the upper and lower transition layers, the surface layers are made of alumina, the transition layers and the core layer are made of zirconia-toughened alumina, and the content of zirconia in the core layer is higher the content of zirconia in the transition layers. The invention also provides a power module using the ceramic substrate. The ceramic substrate provided by the invention uses alumina ceramic as the surface layers and zirconia-toughened alumina ceramic as the transition layers and the core layer, and the contents of zirconia gradiently increase from exterior to interior, so the ceramic substrate has higher strength and toughness and can be extensively applied to the power module.

Description

technical field [0001] The invention belongs to the technical field of power modules, and in particular relates to a ceramic substrate, a preparation method thereof, and a power module. Background technique [0002] Today, with the rapid development of high technology, the high performance, high reliability and high density of electronic devices require that the substrate materials used must have good mechanical properties, electrical properties, heat dissipation properties and soldering properties. The key component used in the power module is the DBC (Direct Bonded Copper) substrate, which is a metal / ceramic bonded substrate. Its main features are high insulation withstand voltage, strong current carrying capacity, and high thermal conductivity. At present, ceramics commonly used in DBC substrates mainly include AlN, Al 2 o 3 , BeO, its performance and thickness are shown in Table 1 below. [0003] Table 1 [0004] . [0005] It can be seen from the above table 1 th...

Claims

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Application Information

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IPC IPC(8): B32B18/00C04B35/10
Inventor 林勇钊林信平
Owner BYD CO LTD
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