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Substrate processing method

A substrate processing method and substrate technology, which is applied in the direction of pretreatment surface, coating, electrical components, etc., can solve the problems of substrate particle pollution, etc., and achieve the effect of preventing pollution and preventing pattern collapse

Active Publication Date: 2016-04-06
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there is concern that the substrate in the processing tank is contaminated by particles

Method used

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Experimental program
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Embodiment Construction

[0038] Next, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description, a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (Plasma Display Panel: plasma display panel), a glass substrate for a photomask, a substrate for an optical disc, and the like.

[0039]

[0040] figure 1 It is a front view of the substrate processing apparatus 1 which concerns on embodiment of this invention.

[0041] This substrate processing apparatus 1 is a device that blows IPA as an organic solvent to the substrate after the cleaning process using pure water to dry the substrate, and mainly includes: a chamber 10, a processing tank 20, a holding mechanism 30, an elevating mechanism 40, Nozzles 51 to 55 , valves 61 to 65 for opening and closing each nozzle, an inert gas supply source 71 for supplying an inert gas such...

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Abstract

The present invention provides a substrate processing method capable of preventing substrate pollution in a step of removing water repellent, and the water repellent is used in water repellent processing for preventing patterns of a substrate from collapsing. The substrate processing method includes the steps of cleaning a substrate in a processing tank, forming an organic solvent vapor atmosphere in a chamber, elevating the substrate to replace a rinse on a surface of the substrate with an organic solvent, draining the rinse from the processing tank, moving the substrate into the processing tank, making the surface of the substrate water-repellent, elevating the substrate and supplying an organic solvent vapor to the substrate to remove water repellent from the surface of the substrate, and drying the substrate with inert gas. The water repellent is removed above the processing tank, and thus the substrate can be dried while contamination of the substrate with particles that can be generated in the processing tank in this step is suppressed.

Description

technical field [0001] The present invention relates to a substrate processing method for processing a semiconductor wafer or a glass substrate (hereinafter simply referred to as a substrate) of a liquid crystal display device with a processing liquid. Background technique [0002] A known substrate processing device has: a processing tank for immersing the substrate in a chemical solution or cleaning solution, etc.; a substrate lifting mechanism for moving the substrate between the processing tank and the space above the substrate processing tank; In the upper space of the tank, an inert gas or the like is blown to the substrate to dry the cleaning liquid such as pure water. In such a substrate processing apparatus, when the cleaning solution is dried, there is a problem that pattern collapse occurs due to capillary action of the cleaning solution remaining in the pattern on the substrate. [0003] In order to solve this problem, a technique is known in which a hydrophobic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/02052B05D3/0486H01L21/67028H01L21/67057C03C17/30C03C2217/76B05D5/08H01L21/02046H01L21/67712H10K71/15
Inventor 基村雅洋
Owner DAINIPPON SCREEN MTG CO LTD