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A kind of filler composition and its application

A composition and mixture technology, which is applied in the field of copper clad laminates, can solve the problems of poor dispersion, low adhesion between adhesive sheets, poor thermal reliability of copper clad laminates, etc., and achieve high dispersion and improved layer quality. Inter-adhesion, the effect of reducing dependence

Active Publication Date: 2018-09-11
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For flame-retardant fillers, the greater the amount of flame-retardant fillers added, the worse the dispersion of the fillers in the resin system on the surface of wood pulp paper, the lower the interlayer adhesion of the adhesive sheet, and finally reflected Deterioration of thermal reliability for copper clad laminates

Method used

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  • A kind of filler composition and its application
  • A kind of filler composition and its application
  • A kind of filler composition and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention will be described in detail below in combination with specific embodiments.

[0022] The manufacturing methods of the copper clad laminates of Examples 1-3 and Comparative Examples 1-5: the specific parameters are shown in Table 1.

[0023] Put low expansion coefficient fillers, thermal conductivity fillers, halogen-free high thermal decomposition temperature flame retardants, thermosetting resins, and curing accelerators into a container and stir evenly to prepare low expansion coefficient fillers, thermal conductivity fillers, and halogen-free high thermal decomposition temperature flame retardants. The total amount of the agent is a composition with a thermosetting resin content of 30wt%, and a solvent is used to adjust the solid content of the solution to 70% to make a glue solution, thereby obtaining the filler composition of the present invention.

[0024] Use wood pulp paper to impregnate the filler composition, dry in an oven to obtain a co...

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Abstract

The invention discloses a filler composition and application thereof. The filler composition comprises the following components in parts by weight: 5-12 parts of filler with low coefficient of expansion, 10-22 parts of heat-conductive filler and 14-31 parts of halogen-free flame retardant with high pyrogenic decomposition temperature. The filler composition is halogen-free and environment-friendly, can be flexibly applied to a resin system of a conventional CEM-1 copper clad laminated plate, can significantly improve the heat reliability of the copper clad laminated plate while ensuring flame retardance of the copper clad laminated plate, and simultaneously facilitates designing the toughness and water resistance of the copper clad laminated plate from the resin system angle.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a filler composition, and also relates to a prepreg made of the filler composition. Background technique [0002] CEM-1 copper-clad laminate is made of electronic grade glass fiber cloth and bleached wood pulp paper, which are respectively impregnated with resin composition for copper-clad laminate to make fabric and core material, and covered with copper foil. Made by hot pressing. [0003] Flame retardancy is the primary performance that CEM-1 copper-clad laminates must achieve. However, CEM-1 copper-clad laminates use wood pulp paper as the core material. The wood pulp paper itself is combustible. It is necessary to ensure that CEM- 1. Under the premise of other properties of copper clad laminates, especially heat resistance, toughness, moisture resistance and other properties, it is very difficult to improve the flame retardancy of CEM-1 copper clad laminates. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L79/04C08K13/02C08K5/3445C08K3/26C08K3/38C08K5/5399C08J5/24
CPCC08J5/24C08J2363/00C08J2479/04C08L63/00C08L2205/025C08L2205/03C08L79/04C08K13/02C08K5/3445C08K2003/265C08K2003/385C08K5/5399
Inventor 霍国洋
Owner SHAANXI SHENGYI TECH
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