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Curable composition for sealing optical semiconductor and optical semiconductor device using the same

A curable composition, optical semiconductor technology, applied in the direction of semiconductor devices, electrical solid devices, electrical components, etc., can solve the problems of low gas permeability, brightness reduction, etc., to improve reliability, improve yield and production property, the effect of suppressing the reduction of brightness

Active Publication Date: 2016-04-13
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If an optical semiconductor device is manufactured using a cured product obtained by curing the composition prepared in the above known art as an LED sealing material, and the optical semiconductor device is used in an environment exposed to sulfuric gas, the sulfuric gas will As time passes, this cured product penetrates and silver turns black, so there are often disadvantages such as a decrease in brightness.
Therefore, as such a composition, it has been required that the gas permeability of the cured product obtained by curing the composition is lower.

Method used

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  • Curable composition for sealing optical semiconductor and optical semiconductor device using the same
  • Curable composition for sealing optical semiconductor and optical semiconductor device using the same
  • Curable composition for sealing optical semiconductor and optical semiconductor device using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0218] To 100 parts by mass of a straight-chain polyfluoro compound represented by the following formula (21) (viscosity 10,900 mPa·s, vinyl content 0.0123 mol / 100 g), sequentially add platinum-divinyltetramethyldisilazine 0.15 parts by mass of a toluene solution (platinum concentration: 0.5% by mass) of an oxane complex, 0.20 parts by mass of a 60% toluene solution of 1-ethynyl-1-hydroxycyclohexane, and an organic compound represented by the following formula (22): 2.87 parts by mass of hydrogen polysiloxane (SiH group equivalent: 0.00428 mol / g), 2.5 parts by mass of organopolysiloxane represented by the following formula (23), 0.50 parts by mass of carboxylic anhydride represented by the following formula (24) parts by mass, and mix until uniform. Then, a defoaming operation was performed to prepare a composition.

[0219]

[0220] In formula (21), h' and i' are integers of 1 or more, and the average value of h'+i' is 90.

[0221]

[0222] In formula (22), j' and k' ...

Embodiment 2

[0226] To 100 parts by mass of the straight-chain polyfluorinated compound represented by the above formula (21), 0.15 oz. Parts by mass, 0.20 parts by mass of a 60% toluene solution of 1-ethynyl-1-hydroxycyclohexane, 1.93 parts by mass of organohydrogenpolysiloxane (SiH group equivalent: 0.00636 mol / g) represented by the following formula (25) parts, 2.5 parts by mass of organopolysiloxane represented by the following formula (26), and 0.50 parts by mass of the carboxylic anhydride represented by the above formula (24), and mixed until uniform. Then, a defoaming operation was performed to prepare a composition.

[0227]

[0228] In formula (25), l' and m' are integers of 1 or more, and the average value of l' is 11, and the average value of m' is 3.

[0229]

Embodiment 3

[0231] To 100 parts by mass of a straight-chain polyfluoro compound represented by the following formula (27) (viscosity 4,010 mPa·s, vinyl content 0.0299 mol / 100 g), sequentially add platinum-divinyltetramethyldisilazine 0.15 parts by mass of a toluene solution (platinum concentration: 0.5% by mass) of an oxane complex, 0.20 parts by mass of a 60% toluene solution of 1-ethynyl-1-hydroxycyclohexane, and an organic compound represented by the following formula (28): 5.99 parts by mass of hydrogen polysiloxane (SiH group equivalent: 0.00499 mol / g), 2.0 parts by mass of organopolysiloxane represented by the following formula (29), 0.50 parts by mass of carboxylic acid anhydride represented by the following formula (30) parts by mass, and mix until uniform. Then, a defoaming operation was performed to prepare a composition.

[0232]

[0233] In formula (27), n' and o' are integers of 1 or more, and the average value of n'+o' is 35.

[0234]

[0235] In formula (28), p' and...

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Abstract

The invention provides a curable composition for sealing an optical semiconductor and an optical semiconductor device. The composite can obtain a cured product which have excellent impact resistance and crack resistance and low gas penetrability and whose hardness is 30 to 70, the hardness is measured by using an A type sclerometer, a waver vapor penetration rate of the 1-millimeter-thick cured product of the abovementioned composition is below 10.0g / m2*day, and the optical semiconductor device has the cured product of the composition. The composition contains the following components: (A) a straight-chain polyfluorinated compound having more than two alkenyl groups in a molecule and having a perfluoropolyether structure in a main chain; (B) organohydrogenpolysiloxane represented by the following general formula (1); (C) a platinum group metal catalyst; and (D) organopolysiloxane having hydrogen atoms directly bonded to silicon atom, a monovalent perfluoroalkyl group or a monovalent perfluorinated oxyalkyl group, and an epoxy group or trialkoxy silane group or both.

Description

technical field [0001] The present invention relates to a curable composition for sealing an optical semiconductor and an optical semiconductor device using the composition. Background technique [0002] Previously, a technique has been proposed to obtain a curable composition having good properties such as heat resistance, chemical resistance, solvent resistance, mold release property, water repellency, oil repellency, and low-temperature characteristics. Balanced and excellent cured product, the composition is composed of the following: linear fluoropolyether compound, which has more than 2 alkenyl groups in one molecule and has a perfluoropolyether structure in the main chain; fluorine-containing organic A hydrogen polysiloxane having two or more hydrogen atoms directly bonded to a silicon atom in one molecule; and a platinum group compound (Patent Document 1). [0003] Furthermore, a composition has been proposed which has imparted resistance to metal or plastic bases b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/00C08L83/08H01L33/56
CPCH01L2224/8592H01L2924/181H01L2224/48247H01L2224/48257H01L2224/49107H01L2924/00012
Inventor 越川英纪
Owner SHIN ETSU CHEM IND CO LTD
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