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Cutting process simulation process for brittle materials

A simulation method and technology of brittle materials, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as mesh distortion

Inactive Publication Date: 2016-04-20
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Smoothed Particle Hydrodynamics (SPH), as an emerging meshless simulation method, solves the problem of mesh distortion when the finite element method deals with large strain and large strain rate, and can simulate well Fragile material separation process, but few reports use SPH method for quartz glass removal mechanism

Method used

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  • Cutting process simulation process for brittle materials
  • Cutting process simulation process for brittle materials
  • Cutting process simulation process for brittle materials

Examples

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Embodiment Construction

[0047] The specific implementation examples of the present invention will be described in detail below in conjunction with the accompanying drawings and technical solutions.

[0048] attached figure 1 It is a flow chart of the implementation process of the present invention. Taking quartz glass as an example, the simulation method of cutting process of brittle materials based on SPH algorithm is explained in detail. Specific steps are as follows:

[0049] Step 1: Set the dimensions of the tool and workpiece material. The tool material is diamond with a density of 3.51g / cm 3 , Elastic modulus 1141GPa, Poisson's ratio 0.07, tool rake angle 10°, relief angle 10°, cutting speed 10m / s. The quartz glass workpiece is designed to be 5×3×0.5μm 3 cube.

[0050] Step 2: Establish a 3D tool finite element model in ANSYS. Since the hardness of diamond is much higher than that of quartz glass, and the research focuses on the processing performance of quartz glass, the diamond tool is ...

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Abstract

The invention provides a cutting process simulation process for brittle materials, belongs to the field of micro-nano ultraprecision machining numerical simulation and relates to a three-dimensional micro-nano cutting machining simulation method based on an SPH (smoothed particle hydrodynamics) method. According to the simulation method, dimensions of a cutter and a workpiece material are set firstly; then a three-dimensional cutter finite element model is established in ANSYS, an SPH model of the workpiece material is established in LS-PrePost, parameters of contact, boundary, the material and the like are set, and calculation is performed in LS-DYNA; finally, a simulation result is analyzed, and whether the result meets the actual machining condition is judged. The simulation method has the advantages that data including stress, strain, density and the like in a cutting machining process can be obtained more clearly and more accurately, the brittle materials are removed from a ductile region through control of cutting depth, and acquisition of more ideal surface quality is more facilitated. A large quantity of labor cost, experimental cost and economic cost is saved, and the problem of on-line observation difficulty of an experimental method is solved.

Description

technical field [0001] The invention relates to the field of numerical simulation of micro-nano ultra-precision machining, and relates to a three-dimensional micro-nano cutting processing simulation method based on a smooth particle fluid dynamics method. Background technique [0002] Due to their excellent physical properties, brittle materials such as optical glass are widely used in aerospace, information, energy, chemical industry, microelectronics and other fields. The traditional method of processing brittle materials is mainly based on grinding, grinding, and polishing to remove brittle domains, and microcracks are prone to occur during loading and processing. These microcracks are more likely to lead to brittle fracture during subsequent processing, and it is difficult to obtain a nano-scale processed surface, which seriously affects the application of brittle materials. At present, through experiments such as indentation and scratches, it has been confirmed that br...

Claims

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Application Information

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IPC IPC(8): G06F17/50
Inventor 郭晓光郑桂林康仁科金洙吉
Owner DALIAN UNIV OF TECH
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