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TFT array substrate and making method thereof

A manufacturing method and array substrate technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as cracks, large leakage current, and low electron mobility, and achieve high mobility and mechanical stability. Excellent performance, reduced thickness, and excellent flex resistance

Active Publication Date: 2016-04-20
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electron mobility of a-SiTFT is lower than 1cm 2 / V -1 the s -1 , which limits the display area and logic control speed
Although LTPS has a high electron mobility, it has a large leakage current, which will affect the touch accuracy and touch operation experience
Amorphous IGZO (Indium Gallium Zinc Oxide, Indium Gallium Zinc Oxide) has a small leakage current, but it is very sensitive to water, oxygen and light, which will affect the service life
More importantly, when the amorphous and polycrystalline semiconductor materials in the above technologies are used for flexible display substrates, they are prone to cracks after repeated bending and folding, which in turn will cause spots, black lines and cracks on the display screen. bright line etc.

Method used

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  • TFT array substrate and making method thereof
  • TFT array substrate and making method thereof
  • TFT array substrate and making method thereof

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Embodiment Construction

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0047] Please see figure 1 , figure 1 It is a structural schematic diagram of the TFT array substrate of the first embodiment of the present invention. like figure 1 As shown, the TFT array substrate 1 of this embodiment includes a rigid substrate 100 and a flexible substrate 101 disposed above the rigid substrate 100 . A first gate 111 is arranged above the flexible substrate 101, a first insulating layer 113 covers the first gate 111 and e...

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Abstract

The invention discloses a TFT array substrate and a making method thereof. A two-dimensional layer type semiconductor material with a similar graphene structure is formed on the substrate, and the two-dimensional layer type semiconductor material with the similar graphene structure is transferred to the designated location of a flexible substrate in a transferring mode so as to serve as a semiconductor active layer of the array substrate. Therefore, the semiconductor active layer of the TFT array substrate adopts the two-dimensional layer type semiconductor material with the similar graphene structure, the array substrate has very high migration rate and mechanical property, flexing resistance is excellent, and the thickness of the substrate is greatly reduced.

Description

technical field [0001] The invention relates to the field of flat panel display technology, in particular to a TFT array substrate and a manufacturing method thereof. Background technique [0002] In the existing flat panel display technology, the TFT (thinfilm transistor, thin film transistor) used for driving uses amorphous silicon (a-Si for short), low temperature polysilicon (LTPS for short) or amorphous IGZO as the semiconductor active layer. . The electron mobility of a-SiTFT is lower than 1cm 2 / V -1 the s -1 , which limits the display area and logic control speed. Although LTPS has a high electron mobility, it has a large leakage current, which will affect the touch accuracy and touch operation experience. Amorphous IGZO (Indium Gallium Zinc Oxide, Indium Gallium Zinc Oxide) has a small leakage current, but it is very sensitive to water, oxygen and light, which will affect the service life. More importantly, when the amorphous and polycrystalline semiconductor ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L21/77H01L27/12H01L27/1214H01L27/1222H01L29/778H01L29/24H01L29/66969H01L29/78603H01L29/78681H01L29/78696H01L27/127H01L27/1225H01L29/66742H01L29/41733H01L29/42384
Inventor 梁博
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD