Substrate processing method, substrate processing apparatus, method for manufacturing semiconductor device, and recording medium
一种处理方法、处理容器的技术,应用在半导体/固态器件制造、电气元件、涂层等方向,达到提高制造产能、提高特性的效果
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[0044] Hereinafter, a first embodiment which is one of preferred embodiments of the present invention will be described in detail with reference to the drawings.
[0045] (1) Structure of the substrate processing device
[0046] First, the main use figure 1 and figure 2 The structure of the substrate processing apparatus according to this embodiment will be described. figure 1 It is a schematic configuration diagram of the substrate processing apparatus according to the present embodiment, and shows the processing furnace 202 in vertical section. figure 2 It is a schematic longitudinal sectional view of the processing furnace 202 included in the substrate processing apparatus according to this embodiment.
[0047] (processing container)
[0048] figure 1 As shown, the processing furnace 202 includes a processing container (reaction tube) 203 . The processing container 203 is made of, for example, quartz (SiO 2 ) or silicon carbide (SiC) and other heat-resistant materi...
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