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Method for forming blackened conductive pattern and blackened conductive ink composition

A technology of ink composition and conductive pattern, which is applied to the formation of conductive patterns, circuits, printed circuits, etc., can solve the problems of reducing visibility and difficulty in forming low-resistance electrodes, and achieve the effect of simple and economical process and improved adhesion

Active Publication Date: 2018-12-28
INKTEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method reduces visibility and makes it difficult to form low-resistance electrodes

Method used

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  • Method for forming blackened conductive pattern and blackened conductive ink composition
  • Method for forming blackened conductive pattern and blackened conductive ink composition
  • Method for forming blackened conductive pattern and blackened conductive ink composition

Examples

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preparation example Construction

[0055] Conventional methods for preparing metal nanoparticles include a physical method of pulverizing metal lumps and a chemical method. Further details of the chemical method include: aerosol method of spraying high-pressure gas to make powder, pyrolysis method of using metal compound and gas reducing agent to make powder by pyrolysis, heating and evaporating raw materials Evaporation concentration method, sol-gel method, hydrothermal synthesis method, ultrasonic synthesis method, microemulsion method and liquid phase reduction method to make powder. The most commonly used is the liquid phase reduction method, which utilizes a dispersant and a reducing agent to prepare, which is easy to control the formation of nanoparticles, and is evaluated as the method with the best economic effect, but in the present invention, as long as nanoparticles can be formed, All methods can be used. For a specific description of the method for preparing nanoparticles by the liquid phase reduct...

preparation example 1

[0115] Ink used for coating (Inked Co., Ltd. ( ) preparation) 10.5g of mixed conductive paste (prepared by Yinkede Co., Ltd.) 19.05g and hexanol 0.45g, and utilize the slurry mixer (Dahua Technology Co., Ltd. ( ) Production) A conductive ink composition was prepared by stirring at 1000 rpm for six minutes.

preparation example 2

[0117] After mixing 30 g of the conductive ink composition prepared in Preparation Example 1 and 0.5 g of 2-ethylhexyl titanate, use a slurry mixer (manufactured by Dahua Technology Co., Ltd.) to stir for three minutes at 1000 rpm to prepare blackened conductive ink combination.

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Abstract

The present invention relates to a method for forming a darkening conductive pattern, comprising: a first filling step for filling a groove of a substrate with a darkening conductive ink composition; and a second filling step for filling the groove with a residual darkening conductive composition by dissolving, with an etching fluid, the residual darkening conductive ink composition remaining on the surface of the substrate while the groove is filled with the darkening conductive ink composition from the first filling step.

Description

technical field [0001] The present invention relates to a method for forming a blackened conductive pattern, and in more detail, relates to a method of mixing a conductive substance and a blackened substance to prepare a blackened conductive ink composition with excellent optical and electrical properties, and filling the groove with the blackened conductive ink composition. A method of blackening a conductive ink composition to form a single-layer conductive pattern. Background technique [0002] Recently, with the trend of thinner and smaller electronic products, electronic components such as displays and transistors are required to be produced in a high-density and high-integration form. Therefore, the technology for forming metal patterns that can be used on electrodes or wiring (metallization) much attention. [0003] Especially in the production technology of the transparent electrode necessary for the touch panel, a fine pattern is formed on the substrate, and a cond...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/10H05K3/12H01B13/00H05K9/00
CPCH05K9/0092H05K3/107H05K3/1258H05K2201/0376H05K2201/09036H05K2203/0139H05K2203/1476
Inventor 郑光春李仁淑金旻熙柳志勳
Owner INKTEC CO LTD