A kind of surface acoustic wave filter chip stripping process pattern optimization method

A surface acoustic wave and peeling process technology, applied in electrical components, impedance networks, etc., can solve the problems of making the thinnest line width smaller than the resolution of the lithography machine, contamination of metal chips on the surface, and poor uniformity of chip line width, etc. Achieve the effect of chip graphics optimization, optimized graphics, and guaranteed corrosion effects

Active Publication Date: 2018-04-13
北京航天微电科技有限公司
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Problems solved by technology

[0003] The purpose of the present invention is to provide a pattern optimization method after chip stripping process of surface acoustic wave filter, which solves the problem of edge burrs after chip pattern stripping, surface metal debris contamination, poor uniformity of chip line width after development, and making the thinnest line width. Problems smaller than the resolution of the lithography machine

Method used

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Embodiment Construction

[0018] A method for optimizing graphics after a surface acoustic wave filter chip stripping process, the specific steps of which are:

[0019] The first step is to uniformly distribute the etching solution on the surface of the wafer

[0020] After the surface acoustic wave filter chip stripping process is completed and the chip pattern is formed, the wafer is fixed on the rotating fixture, so that the corrosion liquid column is dripped at the center of the rotating wafer, and the corrosion liquid is evenly distributed on the surface of the wafer by using the rotating centrifugal force .

[0021] The second step is to etch the stripped wafer pattern with the etching solution

[0022] The etching solution uses tetramethylammonium hydroxide with an equivalent concentration of 2.38%, and the etching solution reacts with the aluminum chip pattern: 2Al+2OH-+2H2O→2AlO2-+3H2↑. This isotropic wet etching method will corrode and remove the burrs, protrusions and residual aluminum scr...

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Abstract

The present invention discloses a figure optimization method of a surface acoustic wave filter chip after a lift-off process. The method comprises the concrete steps: corrosive liquid is uniformly distributed at the surface of a wafer and is configured to corrode the wafer figure, wherein the temperature of the corrosive liquid is maintained in the range of 22 DEG C to 24 DEG C and the rotation speed of a clamp is 1500 rpm+_ 50 rpm; the corrosive liquid or deionized water are configured to scour the surface of the chip through adoption of a centrifugal force generated by rotation of the clamp; the corrosion time is in the range of 60s to 90s, the corrosive liquid is configured to clean the chip, and when the corrosion time is up, the corrosive liquid is closed and the deionized water is opened to clean the chip; and the cleaning and the drying are performed after the corrosion is end, and the figure optimization of the surface acoustic wave filter chip after the lift-off process is completed. According to the invention, the center frequency of a surface acoustic wave filter chip is enhanced, and the reverse offset, of uniform line width caused in the process of photoetching development, is performed; and moreover, the reliability of surface acoustic wave filter products is improved.

Description

technical field [0001] The invention relates to a chip pattern optimization method after photolithography stripping, in particular to a pattern optimization method after surface acoustic wave filter chip stripping process. Background technique [0002] The surface acoustic wave filter is a kind of metal finger electrode made on the surface of the piezoelectric wafer, and the function of electrical signal processing is realized by using the electric-acoustic-electric conversion of the surface acoustic wave filter chip by applying power to the electrode. In the manufacturing process of surface acoustic wave filter chips, photolithography stripping process is often used to make chip patterns. Soaking combined with ultrasonic vibration stripping completes chip graphics production, and the quality of chip graphics molding directly affects the electrical performance parameters of the surface acoustic wave filter. In the traditional SAW filter production process, defects such as b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H3/007H03H3/08
CPCH03H3/007H03H3/08H03H2003/0071
Inventor 贺强
Owner 北京航天微电科技有限公司
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