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UV (ultraviolet) cured LED packaging adhesive resin and method for preparing same

A technology of LED encapsulation and adhesive resin, which is applied in the direction of adhesives, etc., can solve the problems of long curing time and cumbersome glue dispensing process, and achieve the effects of fast curing ability, simple preparation process, small viscosity and shrinkage

Inactive Publication Date: 2016-05-25
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above-mentioned technical problems, the object of the present invention is to provide a one-component UV-curable LED encapsulant and its preparation method. The molecular structure of the one-component UV-curable LED encapsulant contains multiple ethoxylated acrylates, Under the irradiation of UV light, multiple ethoxylated acrylates in the molecular structure of the polymer undergo cross-linking and curing reactions, which can effectively solve the problems of long curing time and glue compounding process in the traditional packaging process. cumbersome and other issues

Method used

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  • UV (ultraviolet) cured LED packaging adhesive resin and method for preparing same
  • UV (ultraviolet) cured LED packaging adhesive resin and method for preparing same
  • UV (ultraviolet) cured LED packaging adhesive resin and method for preparing same

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Embodiment 1

[0032] A preparation method of UV curing LED encapsulation resin, the specific steps are as follows:

[0033] (1) 100 parts of methylphenyldiethoxysilane, 10 parts of hydrogen-containing mixed rings, 30 parts of hydrogen-containing double heads, 20 parts of distilled water, 100 parts of solvent (the weight ratio of toluene and benzene is 1:1 ), 0.03 parts of 38wt% hydrochloric acid were added to the container successively, the temperature was raised to 60°C, and the temperature was kept constant for 5 hours under stirring, and then the temperature was raised to 100°C, and the constant temperature reaction was carried out under stirring for 4 hours. Distill under reduced pressure at 200°C and pressure -0.096MPa for 3.0h to remove the solvent and residual moisture to obtain phenyl hydrogen-containing silicone oil.

[0034] (2) 10g of phenyl hydrogen-containing silicone oil and 10g of ethoxylated trimethylolpropane triacrylate are added in a 500ml three-necked flask, then 0.005g ...

Embodiment 2

[0042] A preparation method of UV curing LED encapsulation resin, the specific steps are as follows:

[0043]Add 105 parts of methylphenyldiethoxysilane, 20 parts of hydrogen-containing mixed rings, 50 parts of hydrogen-containing double-heads, 60 parts of distilled water, 200 parts of toluene, and 0.05 parts of 98wt% sulfuric acid into the container in sequence, and heat up to 60°C, stirring at constant temperature for 5h, then raising the temperature to 120°C, stirring at constant temperature for 4h, the resulting reaction solution was washed with distilled water until neutral, then controlled at 200°C, under reduced pressure at -0.096MPa for 3.0h, To remove the solvent and residual moisture, the phenyl hydrogen-containing silicone oil is obtained.

[0044] Add 15g of phenyl hydrogen-containing silicone oil and 20g of ethoxylated trimethylolpropane triacrylate into a 500ml three-necked flask, then add 0.01 of hydroquinone, pass in protective gas, stir and heat, and raise the...

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Abstract

The invention discloses UV (ultraviolet) cured LED packaging adhesive resin and a method for preparing the same. The method includes sequentially adding 100-105 parts of diethoxysilane, 10-20 parts of hydrogen-containing mixed rings, 30-50 parts of hydrogen-containing double-seal heads, 20-60 parts of distilled water, 100-200 parts of solvents and 0.03-0.05 part of catalysts into a container, carrying out constant-temperature reaction at the temperature of 60-90 DEG C, increasing the temperature until the temperature reaches 100-120 DEG C, carrying out constant-temperature reaction, treating reaction and carrying out post-treatment to obtain phenyl hydrogen-containing silicone oil; enabling the phenyl hydrogen-containing silicone oil and ethoxylation trimethylolpropane triacrylate to react to each other under the effect of the platinum catalysts to obtain the UV cured LED packaging adhesive resin. The UV cured LED packaging adhesive resin and the method have the advantages that the UV cured LED packaging adhesive resin is high in light transmittance, has a high refractive index and can be used in the field of LED packaging and the technical fields of industries of instruments, apparatuses, household appliances, machinery, automobiles, electronic and electrical appliances and the like.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a UV curing LED encapsulation adhesive resin and a preparation method. Background technique [0002] At present, the main processes in the preparation of LEDs involve: solid crystal, curing, bonding, packaging, post-curing, testing and other process steps. The post-encapsulation curing basically needs to heat the device above 100°C to complete the curing of the silicone encapsulant. Curing generally takes several hours, which affects the production efficiency under high-speed production. In addition, the traditional double-package LED encapsulant is also very inconvenient to use. The existing problems mainly include: on the one hand, due to the high viscosity of the encapsulant, the mixing is uneven; On the one hand, when the difference in refractive index between the vinyl phenyl silicone resin and the crosslinking agent increases, the molecular structure ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/38C08G77/12C09J183/05
CPCC08G77/12C08G77/38C09J183/04
Inventor 张英强叶志明姚晨辉吴郢珊李烨吴蓁
Owner SHANGHAI INST OF TECH
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