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A latent curing agent for epoxy resin containing oxazine ring structure, its preparation method and application

A latent curing agent, epoxy resin technology, applied in organic chemistry and other directions, can solve problems such as poor compatibility between dicyandiamide and epoxy resin, and achieve the effects of reducing volatility, improving thermal stability and simple preparation process

Active Publication Date: 2018-06-22
史铁钧
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Secondly, dicyandiamide has poor compatibility with epoxy resin

Method used

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  • A latent curing agent for epoxy resin containing oxazine ring structure, its preparation method and application
  • A latent curing agent for epoxy resin containing oxazine ring structure, its preparation method and application
  • A latent curing agent for epoxy resin containing oxazine ring structure, its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1. Preparation of latent curing agent for epoxy resin

[0028] Weigh 30g (1mol) of paraformaldehyde and 42g (0.5mol) of dicyandiamide into a three-necked flask, then add absolute ethanol, add 47g (0.5mol) of phenol into the flask while stirring, slowly raise the temperature to 80°C, first Use 26% ammonia water to adjust the pH value to 8-9, stir and reflux for 3 hours, then adjust the pH value to 4-5 with 1mol / L hydrochloric acid solution, stir and reflux for 3 hours to obtain a transparent solution, and remove it by rotary evaporation at 80°C solvent and water to obtain the target product.

[0029] 2. Curing

[0030] Blend the epoxy resin (E44) with the latent curing agent prepared in step 1 according to the mass ratio of 1:0.2, stir evenly, let it stand and stand to remove the gas mixed during stirring, place the blended material in a ceramic crucible, and then The ceramic crucible was placed in an electric blast drying oven, and the curing procedure was as follows:...

Embodiment 2

[0032] 1. Preparation of latent curing agent for epoxy resin

[0033] Weigh 81g of formaldehyde solution with a concentration of 37% and 42g (0.5mol) of dicyandiamide into a three-necked flask, then pour into absolute ethanol, add 47g (0.5mol) of phenol to the flask under stirring, and slowly heat up to 80°C , first adjust the pH value to 8-9 with 26% ammonia water, stir and reflux for 3 hours, then adjust the pH to 4-5 with 1mol / L hydrochloric acid solution, stir and reflux for 3 hours to obtain a transparent solution, 80 ° C The solvent and water were removed by rotary evaporation to obtain the target product.

[0034] 2. Curing

[0035] Blend the epoxy resin (E44) with the latent curing agent prepared in step 1 according to the mass ratio of 1:0.25, stir evenly, let it stand and stand to remove the gas mixed during stirring, place the blended material in a ceramic crucible, and then The ceramic crucible was placed in an electric blast drying oven, and the curing procedure...

Embodiment 3

[0037] 1. Preparation of latent curing agent for epoxy resin

[0038] Weigh 30g (1mol) of paraformaldehyde and 42g (0.5mol) of dicyandiamide into a three-necked flask, then pour into absolute ethanol, add 47g (0.5mol) of phenol into the flask while stirring, and slowly heat up to 80°C. First adjust the pH value to 8-9 with ammonia water with a mass fraction of 26%, stir and reflux for 3 hours, then adjust the pH value to 4-5 with 1mol / L hydrochloric acid solution, and stir and reflux for 3 hours to obtain a transparent solution. The solvent and water were distilled off to obtain the target product.

[0039] 2. Curing

[0040] Blend the epoxy resin (E44) with the latent curing agent prepared in step 1 according to the mass ratio of 1:0.3, stir evenly, let stand and stand to remove the gas mixed during stirring, place the blended material in a ceramic crucible, and then The ceramic crucible was placed in an electric blast drying oven, and the curing procedure was as follows: h...

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Abstract

The invention discloses an epoxy-resin latent curing agent with an oxazine ring structure and a preparing method and application thereof. The structural formula of the epoxy-resin latent curing agent with the oxazine ring structure is shown in the specification. According to the epoxy-resin latent curing agent, fatty amine and benzoxazine are combined, and the storage stability of the fatty amine is kept; as the benzoxazine is easily subjected to ring opening polymerization under the heated condition, crosslinking density is increased, and the mechanical performance and the thermal performance of a polymer are improved.

Description

1. Technical field [0001] The invention relates to a curing agent, specifically a latent curing agent for epoxy resin containing an oxazine ring structure, a preparation method and application thereof, and is used as a latent curing agent for epoxy resin. 2. Background technology [0002] Epoxy resins generally refer to organic compounds containing two or more epoxy groups in the molecule. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents. An insoluble polymer with a three-dimensional network structure is formed. The cured epoxy resin has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, small shrinkage rate, good dimensional stability and high hardness. It has good flexibility and is stable to alkali and most solvents, so it is widely used in various sectors of national defense and national...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50C07D265/16
CPCC07D265/16C08G59/506
Inventor 史铁钧李明陈杨石鹏伟
Owner 史铁钧
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