Technology capable of lowering reject ratio of appearance of anti-PID battery
A defect rate and appearance technology, applied in the field of solar cells, can solve problems affecting product quality, poor appearance, short-circuit current and fill factor reduction, etc., to achieve the effect of reducing appearance defects and reducing appearance defect rate
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0019] A process that can reduce the appearance defect rate of the anti-PID battery. The specific implementation steps are: grow a silicon dioxide film on the silicon wafer after texturing, diffusion and etching by the ozone oxidation method, and grow the silicon dioxide film after growing the silicon dioxide film. Place the silicon wafer in the graphite boat, place the graphite boat in the furnace tube of the plasma vapor deposition equipment, evacuate to 10Pa, heat to 450 o C, and then fill the furnace tube with nitrogen, the flow rate is 5slm, adjust the radio frequency power to 3000W, pre-clean the oxide film on the surface of the silicon wafer for 10s, and then re-evacuate, and the flow rate ratio is 8:1-4:1 Ammonia and silane are used to deposit the silicon nitride film. The deposited silicon nitride has a thickness of 80nm and a refractive index of 2.08. The silicon wafer after the silicon nitride film is deposited is taken out of the graphite boat, and the process is co...
Embodiment 2
[0021] A process that can reduce the appearance defect rate of the anti-PID battery. The specific implementation steps are: grow a silicon dioxide film on the silicon wafer after texturing, diffusion and etching by the ozone oxidation method, and grow the silicon dioxide film after growing the silicon dioxide film. The silicon wafer is placed in a graphite boat, and then the graphite boat is placed in the furnace tube of the plasma vapor deposition equipment, vacuumed to 10Pa, heated to 450 o C, then fill the furnace tube with ammonia gas, the flow rate is 3slm, adjust the radio frequency power to 2000W, pre-clean the oxide film on the surface of the silicon wafer for 5s, and re-evacuate, and the flow rate ratio is 8:1-4:1 Ammonia and silane are used to deposit the silicon nitride film. The deposited silicon nitride has a thickness of 80nm and a refractive index of 2.08. The silicon wafer after the silicon nitride film is deposited is taken out of the graphite boat, and the pro...
Embodiment 3
[0023] A process that can reduce the appearance defect rate of the anti-PID battery. The specific implementation steps are: grow a silicon dioxide film on the silicon wafer after texturing, diffusion and etching by the ozone oxidation method, and grow the silicon dioxide film after growing the silicon dioxide film. The silicon wafer is placed in a graphite boat, and then the graphite boat is placed in the furnace tube of the plasma vapor deposition equipment, vacuumed to 10Pa, heated to 450 o C, then fill the furnace tube with ammonia gas, the flow rate is 4slm, adjust the radio frequency power to 2000W, pre-clean the oxide film on the surface of the silicon wafer for 7s, and re-evacuate, and the flow rate ratio is 8:1-4:1 Ammonia and silane are used to deposit the silicon nitride film. The deposited silicon nitride has a thickness of 82nm and a refractive index of 2.09. The silicon wafer after the deposition of the silicon nitride film is taken out of the graphite boat, and th...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com