Technology capable of lowering reject ratio of appearance of anti-PID battery

A defect rate and appearance technology, applied in the field of solar cells, can solve problems affecting product quality, poor appearance, short-circuit current and fill factor reduction, etc., to achieve the effect of reducing appearance defects and reducing appearance defect rate

Inactive Publication Date: 2016-06-01
泰州德通电气有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The phenomenon of potential-induced decay (PID) was first discovered by Sunpower in 2005. The long-term high voltage of solar cell components causes leakage current between glass and packaging materials, and a large amount of charge accumulates on the surface of the cell, which makes the cell surface passivation. The effect deteriorates, resulting in a decrease in open circuit voltage, short circuit current and fill factor, making the component performance lower than the design standard
[0003] The method to prevent this phenomenon is to increase the refractive index of the silicon nitride film, or to grow a silicon dioxide film between the silicon nitride and the silicon substrate by thermal growth or plasma vapor deposition. The refractive index of silicon nitride will lead to a decrease in cell efficiency. The thermal growth method and the plasma vapor deposition method will damage the silicon wafer and the graphite boat respectively. Although the recent method of using ozone oxidation has solved the shortcomings of the above methods, And the cost is low, but because of the plasma-assisted deposition of silicon nitride after the process, the appearance of surface fog spots will occur, and the occurrence rate is between 5% and 50%, which will affect the product quality.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A process that can reduce the appearance defect rate of the anti-PID battery. The specific implementation steps are: grow a silicon dioxide film on the silicon wafer after texturing, diffusion and etching by the ozone oxidation method, and grow the silicon dioxide film after growing the silicon dioxide film. Place the silicon wafer in the graphite boat, place the graphite boat in the furnace tube of the plasma vapor deposition equipment, evacuate to 10Pa, heat to 450 o C, and then fill the furnace tube with nitrogen, the flow rate is 5slm, adjust the radio frequency power to 3000W, pre-clean the oxide film on the surface of the silicon wafer for 10s, and then re-evacuate, and the flow rate ratio is 8:1-4:1 Ammonia and silane are used to deposit the silicon nitride film. The deposited silicon nitride has a thickness of 80nm and a refractive index of 2.08. The silicon wafer after the silicon nitride film is deposited is taken out of the graphite boat, and the process is co...

Embodiment 2

[0021] A process that can reduce the appearance defect rate of the anti-PID battery. The specific implementation steps are: grow a silicon dioxide film on the silicon wafer after texturing, diffusion and etching by the ozone oxidation method, and grow the silicon dioxide film after growing the silicon dioxide film. The silicon wafer is placed in a graphite boat, and then the graphite boat is placed in the furnace tube of the plasma vapor deposition equipment, vacuumed to 10Pa, heated to 450 o C, then fill the furnace tube with ammonia gas, the flow rate is 3slm, adjust the radio frequency power to 2000W, pre-clean the oxide film on the surface of the silicon wafer for 5s, and re-evacuate, and the flow rate ratio is 8:1-4:1 Ammonia and silane are used to deposit the silicon nitride film. The deposited silicon nitride has a thickness of 80nm and a refractive index of 2.08. The silicon wafer after the silicon nitride film is deposited is taken out of the graphite boat, and the pro...

Embodiment 3

[0023] A process that can reduce the appearance defect rate of the anti-PID battery. The specific implementation steps are: grow a silicon dioxide film on the silicon wafer after texturing, diffusion and etching by the ozone oxidation method, and grow the silicon dioxide film after growing the silicon dioxide film. The silicon wafer is placed in a graphite boat, and then the graphite boat is placed in the furnace tube of the plasma vapor deposition equipment, vacuumed to 10Pa, heated to 450 o C, then fill the furnace tube with ammonia gas, the flow rate is 4slm, adjust the radio frequency power to 2000W, pre-clean the oxide film on the surface of the silicon wafer for 7s, and re-evacuate, and the flow rate ratio is 8:1-4:1 Ammonia and silane are used to deposit the silicon nitride film. The deposited silicon nitride has a thickness of 82nm and a refractive index of 2.09. The silicon wafer after the deposition of the silicon nitride film is taken out of the graphite boat, and th...

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Abstract

The invention discloses a technology capable of lowering the reject ratio of the appearance of an anti-PID battery, which is mainly used for reducing the poor appearance caused by an anti-PID battery slice prepared by an ozone oxidization method. The method comprises the following steps: growing a silicon dioxide film on a textured, diffused and etched silicon wafer by the ozone oxidization method; putting the silicon dioxide film into a graphite boat deposited with a silicon nitride film; putting the graphite boat into a plasma vapor deposition furnace tube, pumping vacuum until 10Pa and heating the graphite boat to 350-450 DEG C; filling the tube with a nitrogen gas or an ammonia gas or a mixed gas of the nitrogen gas and the ammonia gas, keeping the air pressure at 230Pa, starting an excitation source and pre-cleaning an oxidation film on the surface of the silicon wafer for a period of time; pumping vacuum again, introducing the ammonia gas and silane, carrying out silicon nitride film deposition; and taking out the silicon wafer deposited with the silicon nitride film from the graphite boat. The technology effectively reduces the poor appearance caused by the anti-PID battery slice prepared by the ozone oxidization method, and does not affect the anti-attenuation effect of the battery slice.

Description

Technical field: [0001] The invention relates to the field of solar cells, in particular to a process capable of reducing the appearance defect rate of anti-PID cells. Background technique: [0002] The phenomenon of potential-induced decay (PID) was first discovered by Sunpower in 2005. The long-term high voltage of solar cell components causes leakage current between glass and packaging materials, and a large amount of charge accumulates on the surface of the cell, which makes the cell surface passivation. The effect deteriorates, resulting in a decrease in open circuit voltage, short circuit current and fill factor, making the performance of the component lower than the design standard. [0003] The method to prevent this phenomenon is to increase the refractive index of the silicon nitride film, or to grow a silicon dioxide film between the silicon nitride and the silicon substrate by thermal growth or plasma vapor deposition. The refractive index of silicon nitride wil...

Claims

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Application Information

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IPC IPC(8): H01L31/0216
CPCH01L31/02167
Inventor 费存勇鲁伟明李省
Owner 泰州德通电气有限公司
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