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Resin composition

A technology of resin composition and epoxy resin, which is applied in the field of resin composition, can solve the problem of insufficient insulation and achieve the effect of high thermal conductivity

Active Publication Date: 2016-06-08
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these inorganic materials have high thermal conductivity, their insulation is not sufficient compared with organic materials, and materials that can balance high insulation and thermal conductivity are required.

Method used

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  • Resin composition
  • Resin composition
  • Resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0185] The present invention will be specifically described below by way of examples, but the present invention is not limited to these examples. In addition, unless otherwise specified, "part" and "%" are based on mass.

[0186] The types, abbreviations or models of epoxy resins, novolac resins, inorganic fillers, additives, and solvents described in Examples are as follows.

[0187](epoxy resin monomer)

[0188] TPM-Ep: Triphenylmethane type epoxy resin (EPPN-502H manufactured by Nippon Kayaku, multifunctional branched solid epoxy resin, epoxy equivalent 168g / eq)

[0189] PhN-Ep: bisphenol F novolak type epoxy resin (jER152 manufactured by Mitsubishi Chemical Co., Ltd., multifunctional and straight chain type liquid epoxy resin, epoxy equivalent 165g / eq)

[0190] BisAF-Ep: liquid bisphenol A type epoxy resin and bisphenol F type epoxy resin mixture (Nippon Steel Chemical ZX-1059, bifunctional liquid epoxy resin, epoxy equivalent 165g / eq)

[0191] (Hardener)

[0192] ReN:...

Embodiment 2～12、 comparative example 4～5

[0286] According to the steps of Example 1, with the materials shown in Table 2, a cured resin was obtained. In addition, curing accelerators, coupling agents, and dispersants which are materials not described in Table 2 were mixed in the same amount as in Example 1.

[0287] 〔Evaluation method〕

[0288] About the resin composition obtained above, it carried out similarly to the above, and measured the thermal conductivity and glass transition temperature of the cured resin. In addition, the flexibility of the resin composition and the dielectric breakdown voltage of the cured resin formed of the resin composition were evaluated as follows. The results are shown in Table 2.

[0289] (softness evaluation)

[0290] The produced B-stage sheet was cut out to a length of 100 mm and a width of 10 mm, and the PET film on the surface was removed. Attach the sample to a jig stacked on a multi-stage aluminum circular plate with a diameter of 20 to 140mm and a 20mm step pitch. When t...

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Abstract

The invention relates to a resin composition. The resin composition contains epoxy resin containing multifunctional epoxy resin, a curing agent containing novolac resin with a structural unit shown in the general formula I, and an inorganic filling material containing nitride particles with the volume percent of 50%-90%. In the general formula I, R1 and R2 respectively and independently represent hydrogen atoms or methyl, m (metered as a mean value) is 1.5-2.5, and n (metered as a mean value) is 1-15.

Description

[0001] The present invention is the application number 201180073184.9 (international application number is PCT / JP2011 / 069845), the application date is August 31, 2011, and the invention name is "resin composition, resin sheet, resin sheet with metal foil, resin cured product A divisional application of the invention application of sheet, structure, and semiconductor device for power or light source". technical field [0002] The present invention relates to a resin composition, a resin sheet, a resin sheet with metal foil, a cured resin sheet, a structure, and a power or light source semiconductor device. Background technique [0003] Along with progress in miniaturization, increase in capacity, and enhancement in performance of electronic equipment using semiconductors, the amount of heat generated from semiconductors mounted at high density is increasing. For example, for the stable operation of the central processing unit used to control the computer, the semiconductor de...

Claims

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Application Information

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IPC IPC(8): C08G59/62C08G59/32C08G59/22C08K3/38C08K3/22C08K3/28
CPCC08G59/22C08G59/32C08G59/62C08K3/22C08K3/28C08K3/38C08K2003/2227C08K2003/282C08K2003/385
Inventor 高桥裕之西山智雄白坂敏明桑野敦司竹泽由高
Owner HITACHI CHEM CO LTD