Flexible heat conduction interface material with wave absorbing function and preparation method thereof

A technology of interface material and wave absorbing material, which is applied in the field of flexible thermal conductive interface material and its preparation, can solve the problems of poor electromagnetic shielding effect and poor conduction performance of thermal conductive interface material, and achieves low hardness, good flexibility and high thermal conductivity. Effect

Active Publication Date: 2016-06-08
PINGHU ALLIED IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a flexible heat-conducting interface material with wave-absorbing function and i

Method used

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Examples

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Embodiment 1

[0019] A flexible heat-conducting interface material with wave-absorbing function, comprising the following components in parts by mass: 100 parts of vinyl silicone oil, 900 parts of heat-conducting filler, 100 parts of wave-absorbing material, 10 parts of hydrogen-containing silicone oil, 0.1 part of platinum catalyst, Inhibitor 0.01 part;

[0020] The viscosity of vinyl silicone oil is 700mPa·S, the thermal conductive filler is hydrophobic alumina with a particle size of 20μm, the absorbing material is ferrite with a particle size of 40μm, the platinum catalyst is Castel Platinum catalyst, and the inhibitor is acetylenic alcohol compound.

Embodiment 2

[0022] A flexible heat-conducting interface material with wave-absorbing function, comprising the following components in parts by mass: 100 parts of vinyl silicone oil with a viscosity of 700 mPa·S, 900 parts of hydrophobic alumina with a particle size of 20 μm, and iron oxide with a particle size of 40 μm 40 parts of oxygen body, 10 parts of silicone oil with a hydrogen content of 0.15%, 0.1 part of Castel platinum catalyst, and 0.01 part of acetylenic alcohol compound.

Embodiment 3

[0024] A flexible heat-conducting interface material with wave-absorbing function, comprising the following components in parts by mass: 100 parts of vinyl silicone oil with a viscosity of 700 mPa·S, 800 parts of hydrophobic alumina with a particle size of 20 μm, and iron oxide with a particle size of 40 μm 200 parts of oxygen body, 10 parts of silicone oil with hydrogen content of 0.15%, 0.1 part of Custer platinum catalyst, and 0.01 part of acetylenic alcohol compound.

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Abstract

The invention relates to a flexible heat conduction interface material with a wave absorbing function, which comprises the following components in parts by mass: 100 parts of vinyl silicone oil, 100 to 1,000 parts of a heat conducting filler, 100 to 1,000 parts of a wave absorbing material, 1 to 50 parts of hydrogen-containing silicone oil, 0.01 to 1 part of a platinum catalyst, and 0.01 to 1 part of an inhibitor. The flexible heat conduction interface material has the advantages that a high-thermal-conductivity caulking interface is produced by a mixture prepared by mixing the vinyl silicone oil, the heat conducting filler, the wave absorbing material, the hydrogen-containing silicone oil, the platinum catalyst and the inhibitor; due to addition of the wave absorbing material, the mixture has an excellent electromagnetic parameter, and the electromagnetic parameter of the mixture can be achieved by regulating a particle size of micro particles of the wave absorbing material; and the flexible heat conduction interface material is beneficial to impedance matching and widening of an absorption band and can meet the requirements of the electron and communication industries for high-efficiency energy conduction and electromagnetic compatibility. In addition, the invention further provides a preparation method of the flexible heat conduction interface material with the wave absorbing function.

Description

technical field [0001] The invention relates to a flexible heat-conducting interface material with wave-absorbing function and a preparation method thereof. Background technique [0002] With the continuous development of electronic products, the miniaturization and high integration of electronic components make the electromagnetic environment we live in more and more complex, causing electromagnetic interference, electromagnetic pollution and information leakage hazards, heat dissipation and electromagnetic shielding are becoming more and more complex. It has become a problem that engineers must face, especially when the two need to be considered. The heat-conducting and absorbing material can be directly applied between the chip and the heat-dissipating metal shell, which can effectively export heat energy and has electromagnetic shielding and electromagnetic clutter. Absorption performance, providing a good solution for electronic communication products in heat conduction...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K3/22C08K5/05
CPCC08L83/04C08L2203/20C08L2205/025C08K2003/2227C08K2003/2272C08K5/05
Inventor 唐正华范勇
Owner PINGHU ALLIED IND
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