High thermal conductivity interstitial interface material and preparation method thereof

A technology of interface materials and thermally conductive fillers, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of electromagnetic interference of conductive gaskets, achieve the effects of reducing thermal resistance, efficient heat transfer, and avoiding electromagnetic interference

Pending Publication Date: 2017-08-18
PINGHU ALLIED IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a high thermal conductivity interstitial int

Method used

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  • High thermal conductivity interstitial interface material and preparation method thereof

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Embodiment 1

[0026] A highly thermally conductive gap-filling interface material, comprising component A and component B, component A comprising a first main material and a first auxiliary material; component B comprising a second main material and a second auxiliary material;

[0027] Both the first major ingredient and the second major ingredient comprise the following components: 100 parts by weight of vinyl silicone oil, 900 parts by weight of thermally conductive filler, 100 parts by weight of wave-absorbing material;

[0028] The first auxiliary material comprises the hydrogen-containing silicone oil of 20 parts by weight;

[0029] The second auxiliary material comprises the platinum catalyst of 0.1 weight part and the inhibitor of 0.001 weight part;

[0030] The absorbing material includes ferrite, and the particle size of ferrite is equal to 40 μm;

[0031] The viscosity of vinyl silicone oil is 500Pa·S;

[0032] The thermally conductive filler includes hydrophobic alumina, and t...

Embodiment 2

[0041] A high thermal conductivity gap-filling interface material as described in Embodiment 1, this embodiment has the following differences:

[0042] Both the first main ingredient and the second main ingredient include the following components: 100 parts by weight of vinyl silicone oil, 900 parts by weight of thermally conductive filler, 100 parts by weight of wave-absorbing material; Methyl hydrogen silicone oil.

[0043] A method for preparing a high thermal conductivity interstitial interface material, comprising the following steps:

[0044] Step 1: Preparation of Component A: Add vinyl silicone oil with a viscosity of 500 Pa·S, methyl hydrogen silicone oil with a hydrogen content of 0.15%, hydrophobic alumina, and ferrite to the planetary machine in order to form materials. The mixing temperature is 25°C, and the mixing time is 30 minutes; then the temperature of the material is raised to 120°C and mixed for 2 hours, and then the delowering is carried out under a vacu...

Embodiment 3

[0048] A high thermal conductivity gap-filling interface material as described in Embodiments 1 and 2, this embodiment has the following differences:

[0049] Both the first main ingredient and the second main ingredient include the following components: 100 parts by weight of vinyl silicone oil, 850 parts by weight of thermally conductive filler, and 150 parts by weight of wave-absorbing material.

[0050] A method for preparing a high thermal conductivity interstitial interface material, comprising the following steps:

[0051] Step 1: Preparation of component A: respectively add vinyl silicone oil with a viscosity of 500 Pa·S, methyl hydrogen silicone oil with a hydrogen content of 0.1%, hydrophobic alumina, and ferrite into the planetary machine in order to form materials. The mixing temperature is 25°C, and the mixing time is 30 minutes; then the temperature of the material is raised to 120°C and mixed for 2 hours, and then the delowering is carried out under a vacuum deg...

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Abstract

The invention relates to a high thermal conductivity interstitial interface material. The high thermal conductivity interstitial interface material is prepared from a component A and a component B, wherein the component A is prepared from a first main material and a first auxiliary material; the component B is prepared from a second main material and a second auxiliary material; a water absorbing material comprises ferrite. The high thermal conductivity interstitial interface material disclosed by the invention has the advantages that the wave absorbing material is added into the component A, and the component A is enabled to absorb or greatly reduce electromagnetic wave energy of surface, so that electromagnetic influence of an existing electrical element on people is avoided, and hazards of electromagnetic interference, electromagnetic pollution and information leakage are avoided; by means of vinyl silicone oil and thermal conductive filler, a produced gasket has low stress and good pressure absorptivity; on the premise of maintaining high thermal conductivity of the high thermal conductivity interstitial interface material, the stress to the device is greatly reduced; the high thermal conductivity interstitial interface material can adaptively fill various complex spaces; damages to a chip due to pressure in a smaller clearance are effectively avoided; besides, the invention provides a preparation method of the high thermal conductivity interstitial interface material. The preparation method comprises the following steps: preparing the component A, preparing the component B and carrying out vulcanization molding.

Description

technical field [0001] The invention relates to a high thermal conductivity interstitial interface material and a preparation method thereof. Background technique [0002] With the development of microelectronics technology, the components of electronic equipment are highly integrated, the volume is getting smaller and smaller, the running speed is getting faster and the power is getting bigger and bigger, and the resulting heat and heat dissipation problems and electromagnetic interference phenomena have a great impact on electronic products. The impact is also increasing, which will affect its normal work and even cause the product to crash. Many parts of electronic products, such as some chip positions with digital control or power amplification and strong electromagnetic radiation devices, have greater heat dissipation and electromagnetic interference. question. At present, the conventional method to solve the heat dissipation problem is to install a thermal pad between...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K3/22C09K5/14
CPCC09K5/14C08L83/04C08L2205/03C08L2205/025C08K2003/2227C08K3/22
Inventor 唐正华范勇
Owner PINGHU ALLIED IND
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