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A kind of cyanide-free silver plating electroplating solution

A technology of cyanide-free silver plating and electroplating solution, applied in the field of cyanide-free silver electroplating, can solve problems such as poor stability and weak coating adhesion, and achieve the effects of fine grain size, good plating solution stability, and fine and smooth appearance.

Active Publication Date: 2018-03-06
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: the poor stability of the existing electroplating silver plating solution system, and the technical problem that the bonding force of the plating layer is not tight

Method used

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  • A kind of cyanide-free silver plating electroplating solution
  • A kind of cyanide-free silver plating electroplating solution
  • A kind of cyanide-free silver plating electroplating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The cyanide-free silver plating solution described in this example is prepared from the following raw materials: silver tetrafluoroborate: 10g / L; methylpentynol 0.8g / L; 1,4-butynediol 0.5g / L; ammonium acetate 10g / L; anisaldehyde 20g / L; benzoic acid 10g / L; wherein the pH value of the cyanide-free silver plating solution is 3.

[0022] The cyanide-free silver plating solution prepared in this embodiment is used for electroplating, with the silver plate as the anode, and the piece to be plated (taking copper as an example) as the cathode, and its specific implementation method is as follows:

[0023] (1) Degreasing, pickling, water washing, chemical polishing, water washing, silver immersion, water washing and then drying the copper substrate once; the chemical polishing uses nitric acid, sulfuric acid, sodium chloride solution, the concentration is 30% nitric acid, 60% sulfuric acid , sodium chloride 4g / L.

[0024] (2) Connect the treated copper substrate and the anode o...

Embodiment 2

[0027] The cyanide-free silver plating solution described in this example is prepared from the following raw materials: silver tetrafluoroborate: 20g / L; methylpentynyl alcohol 0.1g / L; 1,4-butynediol 0.8g / L; ammonium acetate 14g / L; anisaldehyde 7g / L; benzoic acid 16g / L; wherein the pH value of the cyanide-free silver plating solution is 5.

[0028] The cyanide-free silver plating solution prepared in this embodiment is used for electroplating, with the silver plate as the anode, and the piece to be plated (taking copper as an example) as the cathode, and its specific implementation method is as follows:

[0029] (1) Degreasing, pickling, water washing, chemical polishing, water washing, silver immersion, water washing and then drying the copper substrate once; the chemical polishing uses nitric acid, sulfuric acid, sodium chloride solution, the concentration is 30% nitric acid, 60% sulfuric acid , sodium chloride 4g / L.

[0030] (2) Connect the treated copper substrate and the ...

Embodiment 3

[0032] The cyanide-free silver plating solution described in this example is prepared from the following raw materials: silver tetrafluoroborate: 40g / L; methylpentynyl alcohol 1.2g / L; 1,4-butynediol 1.2g / L; ammonium acetate 18g / L; anisaldehyde 12g / L; benzoic acid 20g / L; wherein the pH value of the cyanide-free silver plating solution is 4.

[0033] The cyanide-free silver plating solution prepared in this embodiment is used for electroplating, with the silver plate as the anode, and the piece to be plated (taking copper as an example) as the cathode, and its specific implementation method is as follows:

[0034] (1) Degreasing, pickling, water washing, chemical polishing, water washing, silver immersion, water washing and then drying the copper substrate once; the chemical polishing uses nitric acid, sulfuric acid and sodium chloride solution, the concentration of which is 28% nitric acid and 60% sulfuric acid , sodium chloride 4g / L.

[0035] (2) Connect the treated copper su...

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Abstract

The invention discloses cyanide-free silver electroplating liquid, and belongs to the field of cyanide-free silver electroplating. The cyanide-free silver electroplating liquid is prepared by the following raw materials: 10-60 g / L of silver tetrafluoroborate, 0.1-1.5 g / L of methylpentynol, 0.1-1.2 g / L of 1, 4 butynediol, 10-20 g / L of ammonium acetate, 7-20 g / L of anisaldehyde, and 10-25 g / L of benzoic acid, wherein the pH value of the cyanide-free silver electroplating liquid is 3-7. The cyanide-free silver electroplating liquid contains no cyanide ions, reduces the harm of wastes to the environment and operators, is simple in preparation, and is easy to operate. The stable electroplating liquid can be obtained; the plating layer stress is low; and the bonding force is tighter.

Description

technical field [0001] The invention relates to a cyanide-free silver plating solution, which belongs to the field of cyanide-free silver plating. Background technique [0002] Silver is a precious metal with high application value. Silver has bright white metallic luster, good reversibility and ductility, and is widely used in jewelry, handicrafts, etc.; silver has good photosensitivity and light reflection, and is often used to make photosensitive materials; silver has excellent electrical and thermal conductivity, resistance Corrosiveness makes it an irreplaceable substitute for electrical contact materials, brazing materials, and electronic pastes. [0003] Silver electroplating technology started earlier, as early as 1840, there was cyanide electroplating silver technology, but cyanide silver plating has been dominant for more than 100 years. With people's understanding of the poisoning of cyanide, many researchers began to explore the method of cyanide-free silver pl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/46
CPCC25D3/46
Inventor 于兰天胡劲王玉天段云彪张维均
Owner KUNMING UNIV OF SCI & TECH
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