The invention discloses a surface treatment process of an integrated circuit lead frame. The surface treatment process is characterized by mainly comprising the following steps of oil removal, acid activation, copper plating, silver-tin alloy plating, copper protection, surface treatment and post-treatment. The surface treatment process has the advantages that copper tetrafluoroborate is used as main salt of a copper plating solution, silver tetrafluoroborate and stannous fluoroborate serve as main salt of a silver-tin alloy plating solution, the plating solution does not contain cyanide, is simple in component, healthy and friendly to the environment and workers, reasonable in formula and good in solution stability, on the premise that the quality of a plating layer is guaranteed, the current density is large, the electroplating speed is high and can reach 10 m/min, the electroplating efficiency is high, and the obtained integrated circuit lead frame is high in weldability, uniform in thickness, consistent in brightness, suitable for industrial production and cyclic utilization of liquid medicines, and conforms to the concept of green and environment-friendly production.