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Surface treatment process of integrated circuit lead frame

A lead frame, integrated circuit technology, applied in the electrolysis process, electrolysis components, cells, etc., can solve the problems of incurability, threat to workers' health, environmental pollution, etc., and achieve strong solderability, high electroplating efficiency, and good solution stability. Effect

Pending Publication Date: 2021-11-05
NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, cyanide is often used to plate integrated circuit lead frames, but cyanide is a highly toxic chemical, and its killing dose is only 5 mg, and once absorbed, it cannot be cured at all.
The cyanide content in the cyanide electroplating solution ranges from a dozen grams to as many as one hundred grams, and the liquid volume of the working tank ranges from tens of liters to as many as several thousand liters or even tens of thousands of liters, making the electroplating wastewater Contains cyanide which pollutes the environment and threatens the health of workers

Method used

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  • Surface treatment process of integrated circuit lead frame

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Effect test

Embodiment 1

[0022] This embodiment provides a surface treatment process for an integrated circuit lead frame, which mainly includes the following steps:

[0023] (1) Degreasing: Ultrasonic degreasing and bipolar degreasing are performed on the IC lead frame first, and CY-01 degreasing powder with a concentration of 85g / L is used for both, the temperature is 50°C, and the time is 6-10min / m;

[0024] (2) Acid activation: acid-activate the degreased integrated circuit lead frame with 65ml / L of sulfuric acid at room temperature, the acid activation time is 6-10min / m, then rinse with pure water and dry;

[0025] (3) Copper plating: put the integrated circuit lead frame after acid activation into a Hall tank equipped with copper plating solution for electrodeposition, the time is 6-10min / m, and the copper plating solution mainly includes the following components : Copper Tetrafluoroborate 50g / L, Disodium EDTA 5g / L, Potassium Sulfate 15g / L, Sodium Thiosulfate 20mg / L, then wash with pure water an...

Embodiment 2

[0032] This embodiment provides a surface treatment process for an integrated circuit lead frame, which mainly includes the following steps:

[0033] (1) Degreasing: Ultrasonic degreasing and bipolar degreasing are carried out on the lead frame of the integrated circuit first, and CY-01 degreasing powder with a concentration of 95g / L is selected, the temperature is 60°C, and the time is 10min / m;

[0034] (2) Acid activation: carry out acid activation at room temperature with 75ml / L sulfuric acid on the degreased integrated circuit lead frame, the acid activation time is 6-10min / m, then rinse with pure water and dry;

[0035] (3) Copper plating: put the integrated circuit lead frame after acid activation into a Hall tank equipped with copper plating solution for electrodeposition, the time is 6-10min / m, and the copper plating solution mainly includes the following components : Copper tetrafluoroborate 100g / L, disodium edetate 7.5g / L, sodium citrate 7.5g / L, conductive salt potas...

Embodiment 3

[0042] This embodiment provides a surface treatment process for an integrated circuit lead frame, which mainly includes the following steps:

[0043] (1) Degreasing: Ultrasonic degreasing and bipolar degreasing are carried out on the lead frame of the integrated circuit first, and CY-01 degreasing powder with a concentration of 90g / L is selected, the temperature is 55°C, and the time is 6-10min / m;

[0044] (2) Acid activation: carry out acid activation at room temperature with 70ml / L sulfuric acid on the degreased integrated circuit lead frame, the acid activation time is 6-10min / m, then rinse with pure water and dry;

[0045] (3) Copper plating: put the integrated circuit lead frame after acid activation into a Hall tank equipped with copper plating solution for electrodeposition, the time is 6-10min / m, and the copper plating solution mainly includes the following components : Copper tetrafluoroborate 75g / L, sodium citrate 10g / L, potassium nitrate 22.5g / L, sodium benzoate 35m...

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Abstract

The invention discloses a surface treatment process of an integrated circuit lead frame. The surface treatment process is characterized by mainly comprising the following steps of oil removal, acid activation, copper plating, silver-tin alloy plating, copper protection, surface treatment and post-treatment. The surface treatment process has the advantages that copper tetrafluoroborate is used as main salt of a copper plating solution, silver tetrafluoroborate and stannous fluoroborate serve as main salt of a silver-tin alloy plating solution, the plating solution does not contain cyanide, is simple in component, healthy and friendly to the environment and workers, reasonable in formula and good in solution stability, on the premise that the quality of a plating layer is guaranteed, the current density is large, the electroplating speed is high and can reach 10 m / min, the electroplating efficiency is high, and the obtained integrated circuit lead frame is high in weldability, uniform in thickness, consistent in brightness, suitable for industrial production and cyclic utilization of liquid medicines, and conforms to the concept of green and environment-friendly production.

Description

technical field [0001] The invention relates to the field of integrated circuit lead frames, in particular to a surface treatment process for integrated circuit lead frames. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] In the prior art, cyanide is often used for electroplating lead frames of integrated circuits, but cyanide is a highly toxic chemical, and its killing dose is only 5 mg, and once absorbed, it cannot be cured at all. The cyanide content in the cyanide electroplating...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D3/56C25D3/60C25D5/10C25D5/34C25D5/48C25D7/00C25D21/18
CPCC25D3/38C25D7/00C25D5/34C25D5/48C25D21/18C25D5/10C25D3/567C25D3/60
Inventor 潘龙慧江焕辉
Owner NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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