High-power chip heat radiation device manufacturing method

Abstract

The invention relates to the field of microelectronic heat radiation, and particularly relates to a high-power chip heat radiation device manufacturing method. In view of technical problems of high heat flux density and difficult heat radiation of the high-power chip existing in the prior art, the invention provides the high-power chip heat radiation device manufacturing method. A high-thermal conductivity diamond copper composite material is adopted as a heat sink for heat radiation of a high-power semiconductor, microfluidic channels are designed on the heat sink of the diamond copper, through liquid phase transition layers, a welding technology is adopted to form a steam chamber, vacuum pumping is then carried out, a working medium is injected, shell nosing is finally carried out, the high-power chip is directly welded on a diamond copper carrier with the steam chamber, the high thermal conductivity of the diamond copper and the liquid phase transition are used for heat radiation, and the heat radiation efficiency of the high-power chip is improved.

Description

technical field [0001] The invention relates to the field of microelectronic heat dissipation, in particular to a manufacturing method of a high-power chip heat dissipation device. Background technique [0002] High-power semiconductor chips have particularly high heat dissipation requirements, and at the same time, the thermal expansion coefficient of chip materials is relatively low. Traditional AlSiC, copper, molybdenum copper, tungsten copper and other metals cannot meet their heat dissipation and process matching requirements at the same time. The micro-channel heat dissipation structure of high-power modules is mostly made of metal materials such as aluminum, copper, silicon-aluminum, etc. These materials have a thermal expansion coefficient that cannot match the chip. At the same time, the thermal conductivity of these materials is not high enough, and the heat dissipation effect is not obvious. Microchannel heat dissipation requires liquid to flow in and out of the j...

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is: for the high heat flux density of high-power chips existing in the prior art (that is, high-power chips need better heat dissipation to ensure the normal operation of the chips, otherwise the chips are easy to burn due to poor heat dissipation) , the problem of difficult heat dissipation, providing a method for manufacturing a high-power chip heat sink

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