Method for treating a laser-transparent substrate for subsequently separating the substrate

Abstract

A method for treating a laser-transparent substrate (1) for subsequently separating the substrate (1) along a separating region (2) is proposed, with the following method steps: a.) irradiating the interior of the substrate at a substrate position (3) with beam parameters (zr, w0, l0,lamda) of a laser beam (4) that are set in such a way that in the laser beam (4) there is formed a volume area (5) which is club-shaped or tapers in a pear-shaped manner in the radiating direction (11) and in which a threshold fluence (phi s ) is exceeded to produce a modification, in order to produce a modified region (8) in the interior of the substrate at the substrate position (3), b.) carrying out step a.) at at least one other substrate position (3') to form a separating region (2) comprising the modified regions (8).

Description

technical field [0001] The invention relates to a method for processing a laser-transparent substrate for subsequent separation of the substrate. Background technique [0002] Such a method is known, for example, from EP2258512A1. In the prior art, the substrate is locally melted, so that a structurally weakened region is created inside the substrate. The substrate is broken and thus detached by mechanical effects on the weakened region. [0003] WO 2011 / 025908 A1 discloses a method for cutting chemically hardened glass with laser radiation whose wavelength is transparent to the chemically hardened glass. The laser beam is focused here in the inner tensile region of the chemically hardened glass. [0004] A method for preparing cracks in a substrate is known from WO 2012 / 006736 A2, in which the substrate is irradiated with laser beams such that filaments are produced by self-focusing of the laser beams, along which the substrate can then be split. [0005] Finally, EP149...

AI Technical Summary

Problems solved by technology

Furthermore, when separating substrates, in particular chemically prestressed glass, disadvantageously long processing times and sometimes also unsatisfactory qualities of the cut edges or parting surfaces result with material removal methods.

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