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Assembly-free manufacturing method and device for micromechanical mechanism

A manufacturing method and technology of a manufacturing device, applied in the field of micro-machine manufacturing, can solve the problems of restricting designers' design ideas, difficult to implement parts assembly, and inability to design micro-machines, so as to shorten the research and development and production cycle, shorten the manufacturing time, and enhance the aesthetics. sexual effect

Active Publication Date: 2017-10-31
INST OF MACHINERY MFG TECH CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The production and manufacture of traditional macroscopic mechanical systems is often achieved by assembling individual manufactured parts, but for micro-scale micromachines, even if individual parts can be precisely manufactured, the final assembly of these parts but hard to achieve
Even with the help of special micro-mechanical assembly equipment, the process is often accompanied by problems such as parts that are too small to assemble, physical damage during the assembly process, and contamination of parts by the assembly environment.
Moreover, when designing a micromachine, the designer also needs to consider the assembly method of each part and the corresponding operating space and structure, which not only makes the micromachine unable to be designed smaller, but also limits the designer's design ideas

Method used

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  • Assembly-free manufacturing method and device for micromechanical mechanism
  • Assembly-free manufacturing method and device for micromechanical mechanism
  • Assembly-free manufacturing method and device for micromechanical mechanism

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] Figure 5 is the three-dimensional model of the hinge mechanism of Embodiment 1 of the present invention, Figure 6 It is the three-dimensional model after the first layer of the hinge mechanism of the embodiment of the present invention is formed, Figure 7 It is the three-dimensional model after the second layer of the hinge mechanism of the embodiment of the present invention is formed, Figure 8 It is the three-dimensional model after the third layer of the hinge mechanism of the embodiment of the present invention is formed. Such as Figure 5~Figure 8 The hinge mechanism shown is the manufacturing target, the material is copper, and the specific size is determined, and its manufacturing process according to the assembly-free manufacturing method of the micromechanical mechanism is as follows:

[0079] (a) In the host computer, establish a three-dimensional model of the outer arm 18 and inner arm 19 of the hinge mechanism, and digitally assemble the two to obtain...

Embodiment 2

[0106] Other features of this embodiment are the same as embodiment 1 except the following features:

[0107] The material of the hinge mechanism is nickel.

[0108] In the step (b2), a micro electric discharge milling numerical control program is generated through path planning.

[0109] In the step (c), take a copper block of appropriate size.

[0110] In the step (d), the deposited sacrificial material is copper, preferably, the main component of the electroplating solution may be copper sulfate, and suitable additives are added.

[0111] In the step (e), preferably, the working fluid can be electric spark oil, the cathode can be a tungsten electrode with a diameter of about 30 microns, the power supply can be a pulse power supply of about 70V, and the pulse width modulation is about 0.5 μm.

[0112] In the step (f), the deposited structural material is nickel, preferably, the main component of the electroplating solution may be nickel sulfamate, and appropriate additives...

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Abstract

The invention provides an assembly-free manufacturing method and a device for a micro mechanical structure. The method comprises the following steps: establishing a three-dimensional model of each part of a target mechanical structure, digitally assembling the three-dimensional model into integral machinery, carrying out hierarchical slicing on the integral machinery to obtain each layer of processing graphs, and carrying out processing path planning on graphs on each layer to generate a numerical control program; taking a workpiece substrate to deposit a first material as a sacrificial material in a micro electro-deposition mode, carrying out area-selecting removal on the deposited sacrificial material according to the generated numerical control program in a micro electrical removal processing mode, etching out an area for depositing a structural material in the next step and depositing a second material as the structural material, repeating the steps until the sacrificial material at each layer and the structural material are completely shaped; and finally, removing the sacrificial material to release the mechanical structure, thereby obtaining the target mechanical structure. The invention further provides a device capable of realizing the assembly-free manufacturing method for the micro mechanical structure.

Description

technical field [0001] The invention belongs to the technical field of micro-mechanical manufacturing, and in particular relates to an assembly-free manufacturing method and device for micro-mechanical mechanisms, which specifically relate to micro-electrochemical deposition and micro-electrodemachining (micro-electrolysis and micro-electric spark) technologies, which can The one-time integral forming manufacturing of the micromechanical movable mechanism without assembly is realized at the millimeter and millimeter scales. Background technique [0002] Today's industrial products tend to be more and more integrated and miniaturized, such as micro-motors with a diameter of only 1mm, micro-cameras the size of fingernails, and micro-gyroscopes the size of buttons. These products are composed of micro-electro-mechanical systems. For now, the manufacture of individual micro- or even nano-scale mechanical parts has been realized, but there are still many problems in the manufact...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C64/10B29C64/20B33Y10/00B33Y30/00
CPCB33Y10/00B33Y30/00
Inventor 徐凌羿陈金明张勇斌刘广民龙飞杨正杰
Owner INST OF MACHINERY MFG TECH CHINA ACAD OF ENG PHYSICS
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