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A kind of waste printed circuit board non-metallic powder/EPDM composite material and preparation method thereof

A technology of EPDM and printed circuit boards, which is applied in the field of waste printed circuit board non-metallic powder/EPDM composite materials and their preparation, can solve the problems of inability to reinforce and improve process performance. , reduce cost, improve the effect of tensile stress and tensile strength

Active Publication Date: 2017-10-27
HUAWEI TEHCHNOLOGIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] So far, the filling modification of non-metallic powder of waste printed circuit boards in polymers has been concentrated in the filling modification of thermoplastics and thermosetting plastics. CN 102675717 B proposes modified printed circuit board non-metallic recycled materials and its preparation method. The modified non-metallic powder is also only suitable for plastic filling, and the filling modification of waste printed circuit board non-metallic powder in rubber materials has not been reported. As far as the current situation is concerned, the use of waste printed circuit board non-metallic powder After directly adding rubber, it cannot play a reinforcing role and can only be used as an inert filler

Method used

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  • A kind of waste printed circuit board non-metallic powder/EPDM composite material and preparation method thereof
  • A kind of waste printed circuit board non-metallic powder/EPDM composite material and preparation method thereof
  • A kind of waste printed circuit board non-metallic powder/EPDM composite material and preparation method thereof

Examples

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preparation example Construction

[0057] 1) Preparation of modified waste circuit board non-metallic powder

[0058] After ball milling the non-metallic powder of waste circuit boards in a ball mill for 1-8 hours, after sieving and activating in ozone for 3-15 minutes, add a mercaptosilane coupling agent ethanol solution with a concentration of 10-50% alcoholysis by mass , the alcoholysis time is 5-30 minutes, the stirring time is 10-30 minutes, the stirring speed is 500-1000 rpm, and it is dried naturally; then it is placed in an oven at 80-120°C for 1-3 hours to obtain Modified waste circuit board non-metallic powder, wherein the mercaptosilane coupling agent is selected from one or a mixture of mercaptopropyltrimethoxysilane and mercaptopropyltriethoxysilane. From attached figure 1 And attached figure 2 It can be seen that after ozone treatment, the epoxy resin on the surface of the glass fiber has been removed.

[0059] 2) Ingredients

[0060] Weigh 100 parts of EPDM rubber, 20-120 parts of modified p...

Embodiment 1

[0071]After the non-metallic powder of the discarded circuit board is ball-milled in a ball mill for 1 hour and sieved, it is activated in ozone for 15 minutes, and 100 grams of it is added to 100 grams of mercaptosilane coupling agent ethanol solution with a concentration of 0.5% by mass and stirred for 30 minutes. Dry naturally; then place it in an oven at 80° C. for 1 hour to obtain non-metallic powder of modified waste circuit boards.

Embodiment 2

[0073] After ball milling the non-metallic powder of waste circuit boards in a ball mill for 8 hours and sieving, activate in ozone for 3 minutes, take 100 grams and add 100 grams of mass percent concentration to 1% mercaptosilane coupling agent ethanol solution and stir for 10 minutes, naturally drying; and then placed in an oven at 120° C. for 3 hours to obtain non-metallic powder of modified waste circuit boards.

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Abstract

The invention discloses a waste PCB (printed circuit board) nonmetal powder / EPDM rubber composite material and a preparation method thereof. The composite material comprises, by weight, 100 parts of EPDM rubber, 20-120 parts of modified PCB nonmetal powder, 5-15 parts of grafted EPDM rubber, 0-80 parts of plasticizer, 0-50 parts of filler, 2-5 parts of promoter, 3-5 parts of zinc oxide, 0.8-1.2 parts of stearic acid, and 0.5-1.5 parts of sulfur. The nonmetal powder in the waste PCB is recycled, its reinforcing performance in the EPDM rubber is optimized, and the nonmetal powder of the waste PCB can be used as reinforcing filler of the EPDM rubber effectively. The waste PCB nonmetal powder can be applied from plastic to rubber and is conducive to environment protection.

Description

technical field [0001] The invention mainly relates to the field of resource recovery of mechanical and electrical products, and relates to the recycling of non-metallic powder of waste printed circuit boards, in particular to a non-metallic powder of waste printed circuit board / EPDM composite material and a preparation method thereof. Background technique [0002] With the implementation of my country's sustainable development strategy, higher requirements are put forward for environmental protection, and the recycling and utilization of electronic waste has become a thorny issue faced by most countries. At present, my country has become a big country in the production and consumption of household appliances. Based on the calculation of 2% of annual scrapping and renewal, 20 million household appliances of the four major categories are eliminated every year. In addition, the renewal cycle that is widely used in the whole society is only 2-4 years. Computers, mobile phones an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L23/16C08L63/00C08L51/04C08K13/06C08K9/02C08K9/06C08K7/14C08K3/22
CPCC08L23/16C08L2205/03C08L2205/035C08L63/00C08K13/06C08K9/02C08K9/06C08K7/14C08K2003/2296C08L51/04C08L51/003
Inventor 胡昕汤茂铜赵超王红权邬立灏张建耀
Owner HUAWEI TEHCHNOLOGIES CO LTD