Gradient thermal shock test device based on halogen lamp cofocal heating technology

Abstract

The invention discloses a gradient thermal shock test device based on the halogen lamp cofocal heating technology.The gradient thermal shock test device comprises a test device base, a slidable rotary clamping system, a halogen lamp cofocal heating system, a cooling system, a temperature measuring system, a digital image acquisition system and an integrated control system.The test device base is used for bearing other component systems.The slidable rotary clamping system is used for clamping a sample and controlling the sample to cyclically rotate in a thermal shock test.The halogen lamp cofocal heating system and the cooling system are used for heating and cooling the sample respectively.The temperature measuring system and the digital image acquisition system are used for measuring the temperature of the front / rear face of the sample and capturing surface damage information respectively and transmitting data to the integrated control system.The defects that a traditional gas thermal shock and isothermal thermal cycle test device is high in cost and noise and low in efficiency, and cannot simulate the gradient temperature environment are overcome, and the gradient thermal shock test device is economical, safe, clean, silent and efficient.

Description

Technical field: [0001] The invention relates to a gradient thermal shock test device based on the confocal heating technology of a halogen lamp, which is especially suitable for evaluating the thermal mismatch performance of a film substrate system, and is more economical, safe and efficient than the traditional gas thermal shock test device or thermal cycle test device. With the advantages of cleanliness, quietness and high efficiency, it belongs to the simulation device in the special service environment in the field of mechanical experiments. Background technique: [0002] In the past few decades, the research on thin-film substrate systems has become one of the themes in the development of materials science and engineering. Solid-state thin films have been successfully applied to various engineering systems in many fields such as electronics, information, aerospace, and medicine. And realized a variety of functions. For example, thin-film devices in integrated circuits...

AI Technical Summary

Problems solved by technology

[0004] 1. The demand for fuel is very large, and the cost remains high;

[0005] 2. The gas heating method based on hydrogen-oxygen flame or oxygen-acetylene flame has huge potential safety hazards;

[0006] 3. The gas heating method is easy to produce harmful polluting gas, and the noise pollution is serious;

[0007] 4. Time-consuming and inefficient;

[0008] 5. The observation of the damage state requires manual long-term real-time tracking, which is not easy to operate

However, the isothermal thermal cycle test device cannot realize the thermal shock test considering the temperature gradient

[0010] At present, no test device has been successfully developed that can overcome many shortcomings of the gas thermal shock test device and can realize the thermal shock test under the temperature gradient.

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