Method for reducing viscosity of SEBS-g-MAH solution

Abstract

The invention discloses a method for reducing the viscosity of a maleic anhydride grafted styrene-ethylene-butadiene-styrol copolymer (SEBS-g-MAH) solution. The method is characterized by comprising the following steps: 1) subjecting SEBS-g-MAH to vacuum drying; 2) dissolving SEBS-g-MAH dried in the step 1) in a solvent so as to obtain the SEBS-g-MAH solution; and 3) adding a certain amount of a viscosity reducing aid into the SEBS-g-MAH solution prepared in the step 2) and carrying out uniform mixing under stirring so as to effectively reduce the viscosity of the solution; wherein in the step 2), the solid content of the SEBS-g-MAH solution is 15 to 30%, the viscosity reducing aid used in the step 3) may be dimethyl carbonate, ethyl acetate, butyl acetate, isobutyl acetate, methyl methacrylate, 2-ethylhexyl acrylate, anhydrous ethanol, diacetone alcohol, hydroxypropyl methacrylate or butyl acrylate, or may be a mixed solution of two or more viscosity reducing aids, and the usage amount of the viscosity reducing aid used in the step 3) may account for 6 to 9% of the mass of the solution maximally. According to the invention, the aid for reducing the viscosity of the SEBS-g-MAH solution is found, and the addition amount of the aid is low; and the method is simple and effective, overcomes the problem that a solvent type SEBS-g-MAH adhesive has poor fluidity and makes application of the solvent type SEBS-g-MAH adhesive to module devices and moisture-proof insulating protection materials.

Description

technical field [0001] The invention relates to the field of solvent-based adhesives, in particular to a method for reducing the solution viscosity of maleic anhydride grafted styrene-ethylene-butadiene-styrene copolymer (SEBS-g-MAH). Background technique [0002] SEBS-g-MAH is known as the fourth generation of rubber with safety and environmental protection performance. It has excellent properties such as weather resistance, heat resistance, compression deformation resistance and insulation. It is a multi-purpose thermoplastic elastomer. Its products are industrialized And industrial applications, market development, etc. have become important research hotspots. [0003] In the electrical industry, circuit protection in module devices usually requires a layer of encapsulation material that can protect against moisture and insulation. As a packaging material, it is generally required that the solid content of the solvent-based adhesive is 15-30% and the solution fluidity is...

AI Technical Summary

Problems solved by technology

If these three methods are used to prepare solvent-based SEBS-g-MAH adhesives, the mechanical properties of the adhesive will decrease after film formation and the service life will be shortened.