Porous body and polishing pad

A porous body and polishing pad technology, which is applied in the field of porous bodies, can solve the problems of decreased grinding life, decreased grinding rate, and easy blockage of micropore chambers, and achieves the effect of not being easy to close pores and excellent abrasion resistance

Active Publication Date: 2016-07-06
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the above-mentioned polishing pad is being dressed, there is a problem that the micropore chamber is easily closed, resulting in a decrease in the polishing rate.
In addition, even during grinding, the micropore chamb

Method used

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  • Porous body and polishing pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] Aromatic polyester polyol (made by reacting ethylene glycol with phthalic acid, number average molecular weight 2,000, abbreviated as "aromatic PEs-1" ) 20 parts by mass, aliphatic polyester polyol (formed by reacting ethylene glycol with adipic acid, number average molecular weight 2,000, hereinafter abbreviated as "aliphatic PEs-1") 80 parts by mass, ethylene glycol (hereinafter abbreviated 8 parts by mass of "EG"), 357 parts by mass of N,N-dimethylformamide (hereinafter abbreviated as "DMF"), and 45 parts by mass of 4,4'-diphenylmethane diisocyanate (hereinafter abbreviated as "MDI") Parts by mass were reacted at 60° C. for 6 hours with stirring, then 1 part by mass of isopropyl alcohol (hereinafter abbreviated as “IPA”) was added, and stirred at 60° C. for 1 hour to obtain a polyurethane resin composition. The above polyurethane resin composition had a solid content of 30% by mass, a viscosity of 800 dPa·s, a weight average molecular weight of the polyurethane resin...

Embodiment 2

[0089] The usage-amount of above-mentioned aromatic PEs-1 is changed from 20 mass parts to 50 mass parts, the usage-amount of above-mentioned aliphatic PEs-1 is changed from 80 mass parts to 50 mass parts, obtains in the same way as Example 1 except that A polyurethane resin composition and a porous body. The above polyurethane resin composition had a solid content of 30% by mass, a viscosity of 950 dPa·s, a weight average molecular weight of the polyurethane resin of 91,000, and an aromatic ring content of 1,660 mmol / kg.

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Abstract

The problem to be addressed by the present invention is to provide a porous body with which cells are less readily closed up during dress processing or polishing. The present invention pertains to: a porous body characterized by being obtained by processing, by wet deposition, a urethane resin composition containing an organic solvent (B) and a urethane resin (A) obtained by reacting a polyol (a1) containing an aromatic polyester polyol (a1-1) in the range of 5 to 80 mass%, a polyisocyanate (a2), and a chain extender (a3); and to a polishing pad characterized by being obtained by dress-processing the porous body. This porous body can be used especially suitably as a polishing pad, enhances the polishing life and polishing rate, and makes it possible to reduce the added amount of carbon black used in order to enhance the wear performance during polishing, therefore making it possible to reduce scratching during polishing.

Description

technical field [0001] The present invention relates to a porous body that can be used for, for example, leather-like sheets such as synthetic leather and artificial leather, moisture-permeable waterproof materials, polishing pads, and the like. Background technique [0002] Polishing pads using polyurethane resin compositions are widely used in fields requiring high surface flatness, such as liquid crystal glass, hard disk glass, silicon wafers, and semiconductors. Among them, in the final finish polishing, a porous body processed by a wet film-forming method in which polyurethane resin diluted with a solvent such as DMF (dimethylformamide) is coagulated in water is used. The surface of the porous body is cut (dressed) with a dresser to open pores to form a polishing pad. [0003] As the above-mentioned polishing pad, a polishing pad obtained by processing a polyurethane resin composition made of polyether polyol as a raw material by a wet film-forming method is disclosed ...

Claims

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Application Information

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IPC IPC(8): C08J9/28B24B37/24C08G18/66C08J5/14H01L21/304C08G101/00
CPCC08G18/4238C08G18/12C08G18/3206C08G18/4202C08G18/4213C08G18/7671C08G18/282
Inventor 前田亮后藤直孝千千和宏之
Owner DIC CORP
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