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Manufacturing method of polycrystalline diamond compacts with super-thick diamond layers

A technology of polycrystalline diamond and diamond layer, applied in the field of superhard material manufacturing, can solve the problem that polycrystalline diamond composite sheets cannot be synthesized, etc.

Active Publication Date: 2016-07-20
SF DIAMOND CO LTD
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Problems solved by technology

[0004] In order to solve the problems of the prior art, the present invention provides a method for manufacturing a polycrystalline diamond composite sheet with an ultra-thick diamond layer, which solves the problem that the polycrystalline diamond composite sheet cannot be synthesized when the diamond layer is larger than 3.0mm

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  • Manufacturing method of polycrystalline diamond compacts with super-thick diamond layers

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Embodiment Construction

[0013] The following is an embodiment of the present invention, which is used to manufacture a polycrystalline diamond compact with a total thickness of 11 mm, a diameter of 30 mm, and a diamond thickness of 5.5 mm.

[0014] The manufacturing steps adopted in this embodiment are:

[0015] The first step is to synthesize a polycrystalline diamond blank with a diameter of 31mm and a thickness of 6.5mm by combining diamond micropowder and mixed metal powder of cobalt, nickel, tungsten, iron, and silver at a temperature of 1350-1600°C and a pressure of 6.5GPa , the polycrystalline diamond blank is processed into a polycrystalline diamond blank disc with a diameter of 30.0 mm and a thickness of 5.5 mm through EDM and grinding, and the surface is cleaned.

[0016] In the second step, a certain quality and the proportion of silver is 1-5%, the proportion of copper is 35-70%, the proportion of zinc is 5-20%, the proportion of tin is 1-5%, and the proportion of lead is 1-5%. The mixed...

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Abstract

The invention discloses a manufacturing method of polycrystalline diamond compacts with super-thick diamond layers and solves the problem that the polycrystalline diamond compacts cannot be synthesized when the thickness of the diamond layers is 3.0mm. The method comprises the following steps: firstly synthesizing polycrystalline diamond blank wafers by using diamond micro powder and metal powder under the high-temperature and high-pressure condition, manufacturing transition layers mixed with a plurality of metals on the polycrystalline diamond blank wafers and stacking tungsten carbide alloys on the transition layers, and sintering to form the polycrystalline diamond compacts with super-thick diamond layers. According to the technical scheme, the method is capable of producing batches of polycrystalline diamond compacts with the diamond layers with thickness being greater than or equal to 3.0mm; the yield is greater than 90%.

Description

technical field [0001] The invention relates to a superhard material manufacturing technology, in particular to a method for manufacturing a polycrystalline diamond composite sheet with an ultra-thick diamond layer. Background technique [0002] Polycrystalline diamond composite sheet has the hardness and wear resistance of diamond and the toughness and weldability of cemented carbide matrix material. It is an excellent cutting tool and wear-resistant material. It is widely used in non-ferrous metal processing, wood material processing, Rubber material processing, plastic material processing, grinding wheel dressing tools, high wear-resistant workpieces, etc. [0003] As a high hardness and high wear-resistant composite material, polycrystalline diamond composite sheet inevitably has the same problems as composite materials, that is, due to the difference in thermal expansion coefficient between different materials, stress concentration occurs at the material interface, whic...

Claims

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Application Information

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IPC IPC(8): B22F7/08B22F3/14
CPCB22F3/14B22F7/08B22F2003/145B22F2999/00B22F2201/20
Inventor 屈继来李思成陈金兰马姗姗尚秋元方海江
Owner SF DIAMOND CO LTD
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