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Ultra-wideband Balun based on new interconnection structure

An interconnect structure and ultra-broadband technology, applied in waveguide devices, circuits, connecting devices, etc., can solve the problems of inconvenient processing of lumped element loss circuits in the millimeter wave band, difficulty in realizing wide bandwidth, and large size of broadband baluns. Simple structure, good matching characteristics, small size effect

Inactive Publication Date: 2016-07-20
NANJING UNIV OF SCI & TECH
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  • Application Information

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Problems solved by technology

[0004] Document 1 (Vicente González-Posadas, Carlos Martín-Pascual, José Luis Jiménez-Martín, and Daniel Segovia-Vargas, Lumped-elementbalunforUHFUWBprintedbalancedantennas, IEEETransactionsonantennaandpropagation, 2008, 56, (7): 2102-2107 presented in the low-pass unit structure and high-pass unit respectively) Capacitive and inductive, so that through appropriate parallel measures, the phase reversal characteristics of the two output ports can be obtained, but the balun is based on semi-lumped components, it is difficult to achieve wide bandwidth, and the insertion loss is large
[0005] Document 2 (PengWu, YongZhang, Yu-LiangDong, and QinZhang, AnovelKa-bandplanarbalunusingmicrostrip-CPS-microstriptransition, IEEEMicrowaveWirelessCompon.Lett., 2011, 21, (3): 136-138) uses two symmetrical microstrip lines-coplanar The stripline interconnection structure realizes a broadband balun, but the balun is relatively large in size and complex in structure
[0006] Document 3 (JinShao, RongguoZhou, ChangChen, Xiao-HuaWang, HyoungsooKim, and HualiangZhang, Designofawidebandbalunusingparallelstrips, IEEEMicrowaveWirelessCompon.Lett., 2013, 23, (3): 125-127) used a phase converter to realize a wideband balun. Good port matching characteristics, but larger balun size
[0007] To sum up, (1) the balun designed in Document 1 adopts the implementation method of semi-lumped components, and the loss of lumped components in the millimeter wave band is relatively low and makes the circuit inconvenient to process; (2) the balun designed in Document 2 The wideband balun has a large size and complex structure; (3) The wideband balun designed in Document 3 has the disadvantage of large size

Method used

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  • Ultra-wideband Balun based on new interconnection structure
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  • Ultra-wideband Balun based on new interconnection structure

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Embodiment

[0038] combine figure 1 , figure 2 , image 3 , taking an ultra-wideband balun based on a new interconnect structure operating at 0.15-5.2GHz as an example, the dielectric substrate 9 used has a relative permittivity of 3.38 and a thickness of 0.508mm. The characteristic impedance of the input microstrip line 1 is 50 ohms, the width W1 of the input microstrip line 1 is 1.05 mm, the characteristic impedance of the two-port output microstrip line 6 and the three-port output microstrip line 7 is 75 ohms, and the width W2 is 0.3 mm. The line width of the coplanar stripline 4 is consistent with W2, the length L3 is 4.2mm, and the slot width S1 is 0.17mm; the signal line width of the coplanar waveguide 10 is consistent with W2, the length L4 is 2.4mm, and the slot width S2 is 0.4mm , the distance L2 between the microstrip line 6 at the two-port output end and the microstrip line 7 at the three-port output end is 6.25mm. The radius of the metal via 3 is 0.3 mm, and the distance ...

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Abstract

The present invention provides an ultra-wideband Balun based on a new interconnection structure. The ultra-wideband Balun includes a rectangular dielectric substrate. A T-junction power divider, a coplanar stripline, a two-port output terminal microstrip band, and a three-port output terminal microstrip band are arranged on the front of the dielectric substrate. A two-port output terminal microstrip floor, a three-port output terminal microstrip floor, a coplanar wave guide, and an input terminal microstrip floor are arranged on the back of the dielectric substrate. Multiple round metal through holes are arranged inside the dielectric substrate and are used for connecting devices on the front and back of the dielectric substrate. The ultra-wideband Balun based on the new interconnection structure has a small size, a compact circuit structure, low insertion loss, and a good output port matching feature.

Description

technical field [0001] The invention belongs to the technical field of microwave passive devices, and in particular relates to an ultra-wideband balun based on a novel interconnection structure. Background technique [0002] In the field of antennas, the dipole antenna is a balanced antenna, so a balun is needed to convert the unbalanced signal into a balanced signal to feed the balanced antenna. Baluns are baluns that provide equal-amplitude reverse signals as well as impedance matching. At present, the most common signal transmission line in microwave integrated circuits is microstrip line, which transmits unbalanced signals, while coplanar waveguide and coplanar stripline are single-sided transmission lines, which are small in size, easy to integrate, and easy to realize with microstrip structure. Features such as broadband interconnection structure. Based on this background, we use microstrip-coplanar waveguide and microstrip-coplanar stripline to realize an ultra-wide...

Claims

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Application Information

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IPC IPC(8): H01P5/10
Inventor 林善明顾辉蔡传涛黄烽王建朋
Owner NANJING UNIV OF SCI & TECH
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