Measuring instrument for film residual stress of flexible transparent substrate
A residual stress, transparent substrate technology, applied in the direction of force/torque/power measuring instruments, measuring devices, instruments, etc., can solve the problems of exceeding the measurement range, low reflectivity, and small curvature radius, so as to increase the measurable range and reduce the Interference effects, effects of consistent relative positions
A residual stress, transparent substrate technology, applied in the direction of force/torque/power measuring instruments, measuring devices, instruments, etc., can solve the problems of exceeding the measurement range, low reflectivity, and small curvature radius, so as to increase the measurable range and reduce the Interference effects, effects of consistent relative positions
CN105806531AActive Publication Date: 2016-07-27SHANGHAI UNIV
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[0027] Embodiments of the present invention are described in detail as follows in conjunction with accompanying drawings:
[0028] figure 1 It is the schematic diagram of the single-beam optical lever method, such as figure 1 with figure 2 As shown, the measuring instrument of the residual stress of the film on the flexible transparent substrate of the present invention adopts the principle of the optical lever method to measure the radius of curvature before and after the long film of the substrate, and utilizes the revised Stoney formula to obtain the residual stress; the residual stress of the film on the flexible transparent substrate is The measuring instrument includes an optical platform 25, a first support rod 8, an optical path system, a laser light source system, a sample support system, and a spot tracking three-dimensional motion system; the laser light source system and the optical path system are fixed on the first support rod, and the first The supporting rod...
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The invention provides a measuring instrument for film residual stress of a flexible transparent substrate. The measuring instrument comprises an optical platform, a first supporting rod, a light path system, a laser source system, a sample supporting system and a light spot tracking three-dimensional moving system. The laser source system and the light path system are fixed on the first supporting rod. The first supporting rod is fixed on the optical platform. The light spot tracking three-dimensional moving system and the sample supporting system are respectively arranged on the edges at two sides of the optical platform. The measuring instrument is capable of measuring the film stress of a flexible and transparent substrate with a relatively small curvature radius, the curvature radius is accurately measured by a single light beam optical lever method, a laser source is firstly focused to improve the unit area power of light spots, a three-point positioning method is utilized to fix the sample so as to ensure the relative initial positions in front and at the back of a long film, the measurable range of light spot deviation is greatly increased by the light spot tracking system, and the film residual stress is finally obtained by a corrected Stoney formula.
Description
technical field [0001] The invention relates to a film residual stress measurement technology, in particular to a measuring instrument for a film residual stress on a flexible transparent substrate. Background technique [0002] As a next-generation display technology, flexible display has attracted widespread attention due to its advantages such as bendability, ultra-thin design, ultra-low power consumption, durability, and portability. PEN film, PET film, etc. are often used as flexible substrates, on which flexible organic electroluminescent devices are encapsulated by atomic layer deposition (ALD), plasma enhanced chemical vapor deposition (PECVD), etc. The mature thin film packaging technology plays a vital role in the promotion of flexible display applications, and the packaging effect is closely related to the residual stress of the film. Therefore, it becomes meaningful to test the residual stress of thin films on flexible substrates. [0003] Stoney et al. used fo...
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Patent Timeline
27 Jul 2016
Publication
CN105806531A
- IPC
- G01L5/00; G01B11/255
- CPC
- G01B11/255; G01L5/0047
- Inventors
- 张建华; 帅红俊