A multi-heat pipe composite high-power electronic chip radiator

Abstract

A multi-heat pipe composite high-power electronic chip radiator belongs to the technical field of electronic product auxiliary equipment, including an annular steam cavity base, a gravity heat pipe, heat-driven pulsating flow heat pipe fins, fastening handles, tie hoops, and a cooling fan , enclosure brackets and fastening bolts; the gravity heat pipe is vertically installed on the base of the annular steam chamber, and its internal cavity is connected with the inner ring cavity of the base of the annular steam chamber and is sealed; several heat-driven pulsating flow heat pipe fins The staggered clamping is fixed in the multi-layered flower-shaped card slot on the outer side of the upper shell of the gravity heat pipe, and is tightly fixed to the outer wall of the gravity heat pipe through the fastening handle and the tie hoop. The invention realizes the rational distribution, efficient transportation and release of the heat produced by the high-power electronic chip in the three-dimensional heat dissipation space, and the heat dissipation power is large and the efficiency is high.

Description

technical field [0001] The invention belongs to the technical field of auxiliary equipment for electronic products, and relates to an electronic heat dissipation device, in particular to a multi-heat pipe composite high-power electronic device with high efficiency and high power heat dissipation for solving the heat dissipation problem of an independent high heat flux density electronic chip. Chip heatsink. Background technique [0002] The heat dissipation level of electronic chips and components is directly related to the reliability of electronic equipment, especially for independent high heat flux electronic chips with high thermal load sensitivity (such as CPU, GPU, LED), the accumulation of heat at the chip will Significantly reduce its working stability and service life. In particular, the three major development trends of high performance, miniaturization and integration of electronic components will make the heat dissipation problem more prominent, and the traditio...

AI Technical Summary

Problems solved by technology

However, although various types of heat pipes based on traditional designs have mature processing technology and low production costs, there are still a series of heat transfer limits during their operation, such as carrying limit, capillary limit, etc., resulting in their limit heat dissipation still need to be improved.

In addition, the extended surface of traditional fins with high thermal conductivity metal as the base material is limited in its heat dissipation performance due to the influence of rib efficiency

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