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Growth method of silicon carbide epitaxial layer with high surface quality

A technology of high-quality silicon carbide and growth methods, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as device leakage and failure, and achieve the effect of reducing triangular defects and avoiding the formation of step bunching morphology.

Active Publication Date: 2018-07-10
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Triangular defects can cause device leakage failure, which is a fatal defect

Method used

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  • Growth method of silicon carbide epitaxial layer with high surface quality
  • Growth method of silicon carbide epitaxial layer with high surface quality
  • Growth method of silicon carbide epitaxial layer with high surface quality

Examples

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Embodiment 1

[0025] A method for growing a high-surface-quality silicon carbide epitaxial layer provided in a SiC chemical vapor deposition epitaxial system includes the following steps:

[0026] 1) Select a silicon carbide substrate with a silicon surface that is 4° to the direction, and place the substrate on a graphite base with a tantalum carbide coating in the reaction chamber of the SiC epitaxy system;

[0027] 2) The temperature of the system is raised to 1450°C, and the set pressure is 100mbar, under hydrogen (H 2 ) flow rate of 80L / min, maintain the temperature of the reaction chamber for 5 minutes, and carry out pure hydrogen (H 2 ) etching;

[0028] 3) Introduce a small amount of hydrogen chloride (HCl) into the reaction chamber to assist substrate etching, HCl / H 2 The flow ratio is set to 0.01%;

[0029] 4) Continue to raise the temperature, maintain the temperature for 5 minutes after reaching 1660°C, keep the flow rate of hydrogen chloride (HCl) constant, and continue to ...

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Abstract

The invention discloses a growing method for a high-surface-quality silicon carbide epitaxial layer. The method comprises the steps of 1) selecting a silicon-surface silicon carbide substrate at a deflecting <11-20> direction of 4 degrees, placing the substrate on a graphite base with a tantalum carbide coating inside a reaction chamber of a SiC epitaxial system; 2) heating the reaction chamber of the SiC epitaxial system to increase the temperature in the reaction chamber to be 1450 DEG C, setting the pressure in the reaction chamber to be 90-200 mbar, maintaining the temperature in the reaction chamber for 5-10 minutes with the flow rate of H2 to be 68-80 L / min, and etching the substrate by utilizing the pure hydrogen H2; 3) after the step 2), pumping a small amount of hydrogen chloride (HCl) gas into the reaction chamber to etch the substrate for facilitating the H2 at the flow ratio selection range of HCl / H2 is 0.01%-0.15%, continuously increasing the temperature till the growth temperature of a buffer layer reaches 1650 DEG C-1670 DEG C, wherein the heating process lasts for 10-30 minutes. Based on the above method, triangle defects occurred in epitaxial wafers are effectively reduced. Meanwhile, the formation of the stepped bunching morphology in the epitaxial layer is avoided by utilizing the low-temperature and low-carbon-silicon-ratio buffer layer.

Description

technical field [0001] The invention relates to a growth method of a silicon carbide epitaxial layer with high surface quality, which is mainly applicable to a silicon carbide substrate with a 4° off-axis silicon surface along the <11-20> direction. Mainly through the special buffer layer design, a SiC epitaxial film with no step bunching and less triangular defect density was prepared on a silicon carbide (SiC) substrate with a 4° off-axis along the <11-20> direction. It belongs to the technical field of semiconductor materials. Background technique [0002] SiC materials are suitable for the manufacture of electronic devices such as high temperature, high frequency, high power, radiation resistance, and corrosion resistance. They have broad application prospects in communications, automobiles, aviation, aerospace, oil exploration, and national defense. They are international high-end advanced materials. In order to realize the development of SiC electronic dev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/3205H01L21/02
CPCH01L21/02378H01L21/02529H01L21/02634H01L21/32055
Inventor 李赟
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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