Silicon dioxide enhanced epoxy resin composite material produced by polysilazane in situ
A technology of polysilazane and epoxy resin, which is applied in the field of polymer composite materials, can solve the problems of easy aggregation of nanoparticles, silica reinforcement, adverse effect of toughening effect, weak interaction between nanoparticles and matrix, etc., to achieve Enhance the effect of interfacial interaction and improve dispersibility
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Embodiment 1
[0022] Dissolve 10 parts of polysilazane into 100 parts of bisphenol A glycidyl ether epoxy resin (Shell, EPON 828) under ultrasonic and stirring conditions, and feed water content of 20g / m2 at room temperature 3 Wet nitrogen, wherein the stoichiometric ratio of the amount of water vapor and the amount of polysilazane is about 1.2, polysilazane generates silica nanoparticles in situ, and then add 12.5 parts of diethylenetriamine, mix well, and remove under reduced pressure Bubbles in the system, cured at room temperature for 24 hours, then raised the temperature to 50°C and cured for 24 hours to obtain a silica-reinforced epoxy resin composite material.
Embodiment 2
[0024] Dissolve 1 part of polysilazane into 100 parts of EPON 828 epoxy resin under ultrasonic and stirring conditions, and the water content is 20g / m at room temperature 3 Wet nitrogen, wherein the stoichiometric ratio of the amount of water vapor and the amount of polysilazane is about 1.2, polysilazane generates silica nanoparticles in situ, and then add 12.5 parts of diethylenetriamine, mix well, and remove under reduced pressure Bubbles in the system, cured at room temperature for 24 hours, then raised the temperature to 50°C and cured for 24 hours to obtain a silica-reinforced epoxy resin composite material.
Embodiment 3
[0026] Dissolve 0.1 part of polysilazane into 100 parts of EPON 828 epoxy resin under ultrasonic and stirring conditions, and the water content is 20g / m at room temperature 3 Wet nitrogen, wherein the stoichiometric ratio of the amount of water vapor and the amount of polysilazane is about 1.2, polysilazane generates silica nanoparticles in situ, and then add 12.5 parts of diethylenetriamine, mix well, and remove under reduced pressure Bubbles in the system, cured at room temperature for 24 hours, then raised the temperature to 50°C and cured for 24 hours to obtain a silica-reinforced epoxy resin composite material.
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