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Organic silicon material for packaging and preparation method thereof

A technology of silicone and silicone oil, which is applied in the field of silicone materials for packaging and its preparation, can solve problems such as large internal stress, high cross-linking density, and decreased transparency of epoxy resin, and achieve enhanced strength and good application effects

Inactive Publication Date: 2016-08-24
吴肖颜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, epoxy resin packaging materials are widely used in China. After curing, epoxy resin has high cross-linking density, large internal stress, high brittleness, and poor impact resistance. Moreover, rising temperature and blue light and ultraviolet radiation will make the epoxy resin Transparency is severely reduced

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: A silicone material for encapsulation, characterized in that it is formed by mixing the following components by weight percentage:

[0019] Composite silicone resin 15 parts

[0020] Silicone oil 73 parts

[0021] Catalyst 3 parts

[0022] Diluent 9 parts.

Embodiment 2

[0023] Embodiment 2: A silicone material for encapsulation, characterized in that it is formed by mixing the following components by weight percentage:

[0024] Composite silicone resin 20 parts

[0025] Silicone oil 64 parts

[0026] Platinum catalyst 4 parts

[0027] 12 parts of ethyl acetate.

[0028] Wherein, the method for preparing the organosilicon material for encapsulation, the steps are as follows:

[0029] (1) Add an appropriate amount of composite silicone resin to the silicone oil, and stir evenly to obtain component A;

[0030] (2) Add catalyst and diluent to component A, stir evenly, and react for 1-2 hours to obtain the silicone material for encapsulation.

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Abstract

The invention discloses an organic silicon material for packaging and a preparation method thereof. The organic silicon material is prepared by mixing components: composite silicon resin, organic silicon silicone oil, a catalyst and a diluent. According to the organic silicon material for packaging, which is disclosed by the invention, by repeatedly testing and combining performance of each material, the best formula is obtained; by adding the composite silicon resin, strength of the packaging material is effectively reinforced. Light transmittance can reach 98 percent, and curing time of the packaging material can be changed by regulating the quantity of the catalyst. When the prepared organic silicon packaging material is applied to a high-power white light LED (Light-Emitting Diode), luminous flux of the white light LED can reach 42.65lm by measurement, so that a good application effect is achieved.

Description

technical field [0001] The invention relates to the field of new materials, in particular to an organic silicon material for packaging and a preparation method thereof. Background technique [0002] With the continuous improvement of power white LED manufacturing technology, its luminous efficiency, brightness and power have been greatly improved. At the same time, LED packaging materials are also facing huge challenges. The use of packaging materials with high refractive index, high UV resistance, heat aging resistance, and low stress can significantly improve the light output power and service life of lighting devices. At present, epoxy resin packaging materials are widely used in China. After curing, epoxy resin has high cross-linking density, large internal stress, high brittleness, and poor impact resistance. Moreover, rising temperature and blue light and ultraviolet radiation will make the epoxy resin Transparency is severely reduced. Under high current conditions, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04
CPCC08L83/04C08L2201/10C08L2203/206C08L2205/025
Inventor 吴肖颜
Owner 吴肖颜
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