Transparent conductive film and manufacturing method thereof
A technology of transparent conductive film and conductive film, which is applied in the direction of cable/conductor manufacturing, conductive layer on insulating carrier, equipment for manufacturing conductive/semiconductive layer, etc. Low, damage to the surface of flexible substrates and other issues
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Embodiment 1
[0077] This embodiment relates to an undoped metal oxide type transparent conductive film.
[0078] First, a glass with a thickness of 500 μm is selected as a transparent substrate. Then, a conductive layer is formed on the surface of the glass using a processing method of ion implantation followed by plasma deposition.
[0079] In the process of ion implantation, ZnO is selected as the vacuum cathode arc target, the process temperature of ion implantation is controlled to 600 ℃, and the vacuum is drawn to 2×10 -1 To 5×10 -5 Pa. Control ion implantation energy is 50-100keV, implantation dose is 1.0×10 17 To 5.0×10 17 ion / cm 2 , So that the lower surface of the ion implantation layer is located at a depth of 5-50 nm below the surface of the glass.
[0080] In the plasma deposition process, ZnO is still selected as the vacuum cathode arc target material, the deposition energy of the plasma is controlled to be 1-1000 eV, and a plasma deposition layer with a thickness of about 10-1000 n...
Embodiment 2
[0083] This embodiment relates to a metal oxide doped transparent conductive film of a binary system.
[0084] First, a PI film with a thickness of 6-200 μm is selected as the transparent substrate. Then, a first conductive layer and a second conductive layer are sequentially formed on the surface of the PI film, wherein the first conductive layer is ZnO with a thickness of 5-500 nm, and the second conductive layer is Al or Ag with a thickness of 5-500 nm.
[0085] When preparing the first conductive layer (ZnO), a treatment method of ion implantation followed by plasma deposition is adopted. In the process of ion implantation, ZnO is selected as the target material, the process temperature of ion implantation is controlled to 600℃, and the vacuum is reduced to 2×10 -1 To 5×10 -5 Pa. Control ion implantation energy is 50-100keV, implantation dose is 1.0×10 17 To 5.0×10 17 ion / cm 2 , So that the lower surface of the ion implantation layer is located at a depth of 5-50 nm below the ...
Embodiment 3
[0089] This embodiment relates to a ternary system metal oxide doped transparent conductive film.
[0090] First, a PET film with a thickness of 10-200 μm is selected as the transparent substrate. Then, a first conductive layer and a second conductive layer are sequentially formed on the surface of the PET film, wherein the first conductive layer is MgO 2 -TiO 2 Doped structure, the second conductive layer is In 2 O 3 .
[0091] In the preparation of the first conductive layer (MgO 2 -TiO 2 ), use MgO 2 -TiO 2 The target material is used as a vacuum cathode arc target material, and a processing method of ion implantation followed by plasma deposition is adopted. The target material is prepared by the high-temperature sintering method, that is, the MgO with an average particle diameter of 1 μm or less 2 Powder and TiO 2 The powder is blended and granulated in a high-temperature furnace with an atomic ratio of 1:1, and a certain pressure (8ton / cm 2 ) Shape the produced powder, and th...
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