Light-emitting diode (LED), LED packaging method, straight down type backlight module and liquid crystal display television

A direct-type, encapsulating adhesive technology, applied in optics, circuits, electrical components, etc., can solve the problems affecting the chromaticity consistency and chromaticity non-uniformity of direct-type backlight modules.

Active Publication Date: 2016-08-24
HISENSE VISUAL TECH CO LTD
View PDF3 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Embodiments of the present invention provide an LED, an LED packaging method, a direct-type backlight module, and a liquid crystal television, so as to ov

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-emitting diode (LED), LED packaging method, straight down type backlight module and liquid crystal display television
  • Light-emitting diode (LED), LED packaging method, straight down type backlight module and liquid crystal display television
  • Light-emitting diode (LED), LED packaging method, straight down type backlight module and liquid crystal display television

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] In the present invention, by improving the packaging structure of the LED, that is, two layers of different substances are packaged on the surface of the blue chip, so that the chromaticity of the LED itself becomes uniform, thereby solving the problem of inconsistency in the chromaticity of the direct-type backlight module.

[0031] T...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a light-emitting diode (LED), an LED packaging method, a straight down type backlight module and a liquid crystal display television. An LED packaging structure is achieved by the following steps of first covering the surface of a blue-light chip with a yttrium aluminum garnet (YAG) fluorescent powder layer; and then attaching a packaging glue layer to the surface of the YAG fluorescent powder layer, wherein the packaging glue layer is formed by light diffusion particles and a packaging glue. The refractive index of the YAG fluorescent powder layer is greater than the refractive index of the blue-light chip, so that the blue-light extraction efficiency is improved; the refractive indexes of the light diffusion particles and the packaging glue in the packaging glue layer are different, so that blue light and yellow light can be fully mixed after being refracted in the packaging glue for many times, the chrominance consistency of an LED light emergent surface is improved, and the chromaticity consistency of the straight down type backlight module is further improved.

Description

technical field [0001] The present invention relates to image display technology, in particular to a light-emitting diode (Light-Emitting Diode, referred to as: LED), an LED packaging method, a direct-lit backlight module, and a liquid crystal television. Background technique [0002] Chip-scale packaged LEDs are widely used in backlight modules due to their advantages such as low thermal resistance, good heat dissipation, and high current drive capability. In direct-lit backlight modules, LEDs need to be used with secondary lenses. The secondary lens can increase the beam angle of the light and form a larger spot on the exit surface. [0003] Since the main components of white light are blue light and yellow light, the most common way to synthesize white light is to use a blue-emitting gallium nitride blue chip to excite yellow yttrium aluminum garnet crystal (YttriumAluminate Garnet, referred to as: YAG) phosphor , to produce white light. [0004] In order to produce wh...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L33/52H01L33/56H01L33/58H01L33/00G02F1/1333G02F1/13357
CPCG02F1/1333G02F1/133603H01L33/00H01L33/52H01L33/56H01L33/58
Inventor 曹晓梅高上邱婧雯杨洲
Owner HISENSE VISUAL TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap