High-precision ultrathin diamond cutting disk and preparation method therefor

Abstract

The invention relates to a high-precision ultrathin diamond cutting disk which is characterized by comprising the following components in percentage by weight: 40-60% of diamond particles, 10-40% of CuSn20, 10-20% of branch-shaped copper powder, 0.5-10% of carbonyl iron powder, 1-10% of tin powder, 0.5-5% of silicon powder, 0.5-5% of silver powder and 0.5-1% of graphite powder; and the particle size of the diamond particles, CuSn20, the branch-shaped copper powder, the carbonyl iron powder, the tin powder, the silicon powder, the silver powder and the graphite powder is 300-400 meshes. The invention further relates to a preparation method for the high-precision ultrathin diamond cutting disk. The high-precision ultrathin diamond cutting disk has the advantages of high cutting precision, small broken edge and long service life.

Description

technical field [0001] The invention relates to a diamond cutting sheet, in particular to a high-precision ultra-thin diamond cutting sheet and a preparation method thereof. Background technique [0002] Diamond cutting discs are mainly used for precision cutting and grooving of hard and brittle materials such as coated glass, wafers, and lithium niobate. They are specially used in conjunction with various imported and domestic dicing machines and grooving machines; mm; For a highly competitive industry such as semiconductor chips, with the continuous integration of computing, communication and entertainment functions, as well as the continuous growth of wireless, portable, portable and other digital and optoelectronic consumer electronics products, the requirements for cutting sheets Higher and higher. The cutting of hard and brittle precious materials is particularly prone to edge chipping. In order to make up for this defect, resin cutting discs are generally used intern...

AI Technical Summary

Problems solved by technology

The cutting of hard and brittle precious materials is particularly prone to edge chipping. In order to make up for this defect, resin cutting discs are generally used internationally. Due to the harsh conditions of use of diamond cutting discs, they are very thin and easy to crack or break. Extremely high (30~80KYPM), linear speed reaches 120~200 m / s, withstands great impact and centripetal force, high feed speed (5~50krpm) and deep cut (0.5~2.5mm) conditions for cutting , to withstand large workload and high cutting heat, but also to withstand the forced cooling of pure water with a flow rate greater than 1L / min in multiple directions. The cutting blade is consumed quickly during work, so the service life of the resin cutting blade is short, and it needs to be replaced frequently. Knives, thereby increasing the frequency of diamond cutting disc replacement, reducing work efficiency and increasing production costs