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Multi-purpose modified epoxy resin adhesive

An epoxy resin, multi-purpose technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of repairing glue stickiness, excessive filler, insufficient material toughness, etc., to achieve good toughness and impact resistance Ability, high bond strength, fast curing effect

Inactive Publication Date: 2016-09-07
北京中德新亚建筑技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Epoxy resin repair glue is a kind of structural reinforcement and leveling glue. The existing technology has the following problems: 1. The same kind of repair glue has stagnation, poor construction, or flowing phenomenon when constructing on the back, which not only affects the waste of engineering materials but also affects the construction environment.
2. Similar repair adhesives generally have problems such as excessive fillers and insufficient material toughness
3. It is not allowed to use in humid environment
4. Single function

Method used

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  • Multi-purpose modified epoxy resin adhesive
  • Multi-purpose modified epoxy resin adhesive

Examples

Experimental program
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Effect test

example 1

[0017] A multifunctional modified epoxy resin repair glue, which is made of the following materials according to the mass ratio:

[0018] A component:

[0019] Main agent: bisphenol A type epoxy resin E-51 100 parts

[0020] Toughening agent: Qishi toughening agent 14 parts

[0021] Reactive diluent: 6 parts of benzyl glycidyl ether

[0022] Thixotropic agent: white carbon black (fumed silica) 3 parts

[0023] Filler: 400 mesh silica powder 120 parts

[0024] Component B:

[0025] Curing agent: compound curing agent 35 parts

[0026] Accelerator: DMP-30 1.5 parts

[0027] Coupling agent: KH-550 2 parts

[0028] Thixotropic agent: white carbon black (fumed silica) 2 parts

[0029] Active filler: 40 parts of active silica powder

[0030] The mass ratio of component A and component B is 3:1

[0031] Implementation results: product testing results are shown in Table 1

example 2

[0033] A multifunctional modified epoxy resin repair glue, which is made of the following materials according to the mass ratio:

[0034] A component:

[0035] Main agent: bisphenol A type epoxy resin E-51 100 parts

[0036] Toughening agent: Qishi toughening agent 13 parts

[0037] Reactive diluent: 7 parts of benzyl glycidyl ether

[0038] Thixotropic agent: white carbon black (fumed silica) 3 parts

[0039] Filler: 400 mesh silica powder 120 parts

[0040] Component B:

[0041] Curing agent: compound curing agent 35 parts

[0042] Accelerator: DMP-30 2 parts

[0043] Coupling agent: KH-550 2 parts

[0044] Thixotropic agent: white carbon black (fumed silica) 2 parts

[0045] Active filler: 40 parts of active silica powder

[0046] The mass ratio of component A and component B is 3:1

[0047] Implementation results: product testing results are shown in Table 1

example 3

[0049] A multifunctional modified epoxy resin repair glue, which is made of the following materials according to the mass ratio:

[0050] A component:

[0051] Main agent: bisphenol A type epoxy resin E-51 100 parts

[0052] Toughening agent: Qishi toughening agent 12 parts

[0053] Reactive diluent: 8 parts of benzyl glycidyl ether

[0054] Thixotropic agent: 2.5 parts of white carbon black (fumed silica)

[0055] Filler: 400 mesh silica powder 120 parts

[0056] Component B:

[0057] Curing agent: compound curing agent 40 parts

[0058]Accelerator: DMP-30 1.5 parts

[0059] Coupling agent: KH-550 2 parts

[0060] Thixotropic agent: white carbon black (fumed silica) 2 parts

[0061] Active filler: 40 parts of active silica powder

[0062] The mass ratio of component A and component B is 3:1

[0063] Implementation results: product testing results are shown in Table 1

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Abstract

The invention discloses a multi-purpose modified epoxy resin adhesive which comprises a component A and a component B, and the mass ratio of the component A to the component B is 3:1; the component A comprises the following components in parts by weight: 100 parts of bisphenol A-type epoxy resin, 10-15 parts of a toughening agent, 5-10 parts of an active diluent, 2-4 parts of a thixotropic agent and 100-150 parts of a filler; the component B comprises the following components in parts by weight: 30-55 parts of a composite curing agent, 1-3 parts of an accelerator, 1-3 parts of a coupling agent, 1-3 parts of a thixotropic agent and 30-50 parts of an active filler. The multi-purpose modified epoxy resin adhesive disclosed by the invention is excellent in thixotropic property, good in construction performance and free from flowing during construction on sunny sides, resistant to acid and alkali medium erosion, high in normal temperature curing speed, free from volatile matters contained, non-toxic and harmless, high in bonding strength and good in toughness and impact resistance.

Description

technical field [0001] The invention belongs to the technical field of engineering materials and relates to a multifunctional modified epoxy resin repair glue. Background technique [0002] Epoxy resin repair glue is a kind of structural reinforcement and leveling glue. The existing technology has the following problems: 1. The same kind of repair glue has stagnation, poor construction, or flowing phenomenon when constructing on the back, which not only affects the waste of engineering materials but also affects the construction environment. . 2. Similar repair adhesives generally have problems such as excessive fillers and insufficient material toughness. 3. It is not allowed to use in humid environment. 4. Single function. Contents of the invention [0003] In order to solve the problems existing in the prior art. The invention provides a multifunctional modified epoxy resin repair glue. [0004] The object of the present invention is achieved through the following ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/04C09J11/06C09J11/08C08G59/60
CPCC09J163/00C08G59/60C08K2201/014C08L2201/08C08L2207/02C09J11/04C09J11/06C09J11/08
Inventor 王学振
Owner 北京中德新亚建筑技术有限公司
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