High-temperature-resistant light emitting diode (LED) lamp filament encapsulation adhesive

A technology of LED filament and encapsulant, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of poor heat resistance of encapsulation adhesives, reduce the risk of water vapor being introduced, and reduce cracking risk, the effect of reducing the crosslink density

Inactive Publication Date: 2016-09-21
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the current problem of poor heat resistance of encapsulation adhesives caused by residual silicon hydroxyl groups in raw materials, the present invention provides a high temperature resistant LED filament encapsulation adhesive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Preparation of component A: 97.5 parts of vinyl silicone oil (vinyl content 0.50%, viscosity 350cs, volatile content 0.4%), 2.5 parts of platinum catalyst (platinum content 2000ppm) were vacuum defoamed and mixed uniformly.

[0028] Preparation of component B: 88.2 parts of vinyl silicone oil (vinyl content 0.16%, viscosity 3500cs, volatile content 0.5%), 5 parts vinyl silicone resin (vinyl content 0.6%, viscosity 6000cs, volatile content 0.5%), 0.5 Parts of a hydroxyl scavenger (hexamethyldisilazane) were mixed uniformly, and the reaction was carried out at 120° C. for 4 hours under a nitrogen atmosphere. After cooling, add 2 parts of hydrogen-containing silicone oil (viscosity 40cs, active hydrogen content 0.5%), 0.01 part of inhibitor (3-octyl-1-butyn-3-ol), 0.8 part of tackifier (γ-methylpropene) Acyloxypropyltrimethoxysilane) was mixed evenly, and 3.5 parts of thixotropic agent (hydrophobic gas-phase silica treated with D4, specific surface area 260m) was added. 2...

Embodiment 2

[0030] Preparation of component A: 99 parts of vinyl silicone oil (vinyl content 0.26%, viscosity 1500cs, volatile content 0.4%) and 1 part platinum catalyst (platinum content 2000ppm) were vacuum defoamed and mixed uniformly.

[0031] Preparation of component B: 72.8 parts of vinyl silicone oil (vinyl content 0.26%, viscosity 1500cs, volatile content 0.4%), 15 parts vinyl silicone resin (vinyl content 0.97%, viscosity 7000cs, volatile content 0.5%), 1.5 parts Parts of a hydroxyl scavenger (octamethylcyclotetrasilazane) were mixed uniformly, and the reaction was carried out at 140° C. for 3 hours under a nitrogen atmosphere. After cooling, add 2.2 parts of hydrogen-containing silicone oil (viscosity 70cs, active hydrogen content 0.8%), 0.015 parts of inhibitor (1-ethynylcyclohexanol), 1.5 parts of tackifier (vinyltriethoxysilane) and mix well, Add 7 parts of thixotropic agent (HMDS treated hydrophobic fumed silica, specific surface area 220m 2 / g) Mix well. Transfer the mate...

Embodiment 3

[0033] Preparation of component A: 99 parts of vinyl silicone oil (vinyl content 0.27%, viscosity 1000cs, volatile content 0.4%) and 1 part platinum catalyst (platinum content 5000ppm) were vacuum defoamed and mixed uniformly.

[0034] Preparation of component B: 59.8 parts of vinyl silicone oil (vinyl content 0.26%, viscosity 1500cs, volatile content 0.4%), 30 parts vinyl silicone resin (vinyl content 1.3%, viscosity 5000cs, volatile content 0.5%), 1 Parts of a hydroxyl scavenger (octamethylcyclotetrasilazane) were mixed uniformly, and the reaction was carried out at 130° C. for 4 hours under a nitrogen atmosphere. After cooling, add 3 parts of hydrogen-containing silicone oil (viscosity 70cs, active hydrogen content 0.8%), 0.015 parts of inhibitor (1-ethynylcyclohexanol), 1.2 parts of tackifier (γ-methacryloyloxypropyltrimethyl) Oxysilane) mixed evenly, add 5 parts of thixotropic agent (hydrophobic fumed silica treated with dimethyldichlorosilane, specific surface area 210m ...

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Abstract

The invention relates to high-temperature-resistant light emitting diode (LED) lamp filament encapsulation adhesive, prepared from a component A and a component B, wherein the component A is prepared from 97.5-99% parts by weight of vinyl silicone oil and 1-2.5 parts by weight of a catalyst; the component B is prepared from 50-88.2 parts by weight of the vinyl silicone oil, 5-40 parts by weight of vinyl silicone resin, 2-5.5 parts by weight of hydrogen-containing silicone oil, 3.5-7 parts by weight of a thixotropic agent, 0.5-1.5 parts by weight of a hydroxyl scavenger, 0.01-0.02 part by weight of an inhibitor and 0.8-1.5 parts by weight of a tackifier; when in use, the component A is mixed with the component A according to the mass ratio of 1: 10. The LED encapsulation adhesive has excellent heat resistance stability, is applicable to LED lamp filament encapsulation, can resist high temperature cracking, and produces less oil after a lamp is lightened for a long time.

Description

technical field [0001] The invention relates to the field of organic silicon LED packaging glue, in particular to a high temperature resistant LED filament packaging glue. Background technique [0002] LED lighting has the characteristics of small size, high brightness and low energy consumption, and is expected to replace incandescent fluorescent lamps and become the mainstream indoor lighting source. In recent years, LED filament lamps have sprung up and are sought after by users and manufacturers. In the past, LED light sources, such as in-line LEDs, SMD LEDs, COB and other LED lamp beads, can only be flat light sources without lenses and other optical devices, while LED filament lamps can achieve 360-degree full-angle stereo lighting On the other hand, the manufacturing process of LED filament lamps is close to that of incandescent lamps, so that incandescent lamp manufacturers can also use a large number of original equipment to transform into the LED field. [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06H01L33/56
CPCC08K2201/014C08L2205/025C08L2205/035C08L2312/00C09J11/04C09J11/06C09J183/04H01L33/56C08L83/04C08K13/06C08K3/36C08K5/5425C08K5/5435
Inventor 江昊高传花韩志远张利安林天翼
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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