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Ring type consolidated diamond scroll saw cutting device and workpiece cutting method

A technology of diamond wire saws and cutting devices, which is applied in the direction of working accessories, stone processing equipment, fine working devices, etc., can solve the problems of wire saw wire instability, processing efficiency and processing quality decline, etc., to reduce difficulty and improve processing efficiency effect

Inactive Publication Date: 2016-10-26
UNIV OF SHANGHAI FOR SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the force between the wire saw wire and the workpiece is mainly provided by the wire saw wire extruding and cutting the workpiece. The opening angle of the wire saw wire will increase with the increase of the sawing force, and the greater the opening angle The more unstable the wire saw wire, the lower the processing efficiency and processing quality

Method used

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  • Ring type consolidated diamond scroll saw cutting device and workpiece cutting method

Examples

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Comparison scheme
Effect test

Embodiment 1

[0031] figure 1 It is a schematic structural diagram of a ring-type consolidated diamond wire saw cutting device according to an embodiment of the present invention.

[0032] The ring-type consolidated diamond wire saw cutting device 100 includes a mounting base (not shown in the figure), a feeding unit 10 , a wire saw unit 20 , a workpiece fixing unit 30 , a magnetic force unit 40 and a control unit.

[0033] The feeding unit 10 is arranged on the installation base, and is used to drive the wire saw unit 10 to move for feeding movement. In this embodiment, an existing X-Y moving platform is selected, and the X-Y moving platform has a movable part.

[0034] The wire saw unit 20 has a frame 21, a driving mechanism 22, two guide wheels 23a and 23b, a tension wheel 24, a wire storage drum 25, and a wire saw wire 26 surrounding the above components and forming a closed loop.

[0035] The frame 21 is fixed on the moving part of the X-Y moving platform by bolts.

[0036] The drivi...

Embodiment 2

[0055] Workpiece cutting method

[0056] Here we take a general wire saw to cut silicon crystal as an example for illustration. It consists of the following two steps:

[0057] Step 1: After connecting the silicon crystal workpiece with the horn, fix the horn on the workbench of the wire saw through the clamp, and connect the horn with the ultrasonic vibration device. In this embodiment, the workpiece is made of silicon crystal, and it can also be other Hard and brittle materials include gemstones, glass, silicon crystals, ceramics, etc.

[0058] Step 2: Set the relative position between the wire saw and the workpiece, fix the two electromagnets of the magnetic unit to the outlet and inlet ends of the wire saw wire cutting part, turn on the ultrasonic vibration device and the wire saw, and adjust the electromagnets respectively The distance from the wire saw wire and the position of the electromagnet, and the frequency and amplitude parameters of the appropriate ultrasonic v...

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Abstract

A ring-type consolidated diamond wire saw cutting device, which is connected with an ultrasonic vibration device, includes: a wire saw unit with a drive mechanism, at least one guide wheel, and a wire saw wire that surrounds the drive mechanism and the guide wheel and forms a closed loop, and drives The mechanism drives the wire saw wire to make the main cutting movement; the feed unit is connected with the wire saw unit and is used to drive the wire saw wire to move along the direction perpendicular to the main cutting motion of the wire saw wire; the workpiece fixing unit is fixedly arranged on the feed unit In the moving direction, it is used to fix the workpiece. The workpiece fixing unit has: a fixed fixture; a horn arranged on the fixture and connected to the ultrasonic vibration device is used to amplify the high-frequency vibration input by the ultrasonic vibration device, and the fixture clamps the workpiece and is in contact with the horn. The horn connected with the ultrasonic vibration device applies vibration to the workpiece, causing the workpiece to vibrate ultrasonically, so that the workpiece has a continuous impact on the wire saw wire, which reduces the difficulty of the wire saw wire cutting into the workpiece, thereby improving processing efficiency.

Description

technical field [0001] The invention relates to a wire saw cutting device and a corresponding cutting method, specifically belonging to the technical field of wire saw cutting. Background technique [0002] With the rapid development of industry, the application of hard and brittle materials in various fields is becoming more and more common. Hard and brittle materials mainly include various gemstones, glass, silicon crystals, ceramics, etc., which have excellent properties such as high hardness, high brittleness, and high wear resistance. However, if the processing method is not selected properly, the low plasticity and brittleness of hard and brittle materials will easily cause the surface layer of the workpiece to be damaged. In the processing of hard and brittle materials, sawing is often the first process and occupies a very important position. For this reason, diamond circular saws, band saws, wire saws and other equipment are usually used for sawing hard and brittle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D1/06B28D7/00
CPCB28D5/045B28D1/06B28D5/047B28D7/00
Inventor 王艳秦琛彭水平崔西民朱新庆
Owner UNIV OF SHANGHAI FOR SCI & TECH
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