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Shell resonator with impact resistance

An anti-shock and resonator technology, applied in the field of vibration resonators, can solve the problems of reducing the sensitivity of hemispherical resonant gyroscopes, difficult electrode integrated preparation or assembly design and preparation, etc., to improve environmental robustness and impact resistance, Achieve the effect of quality factor and reduce processing difficulty

Active Publication Date: 2016-10-26
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The difficulty of the first type of technology lies in the preparation of a hemispherical or hemispherical cavity. The hemispherical resonant gyroscope requires extremely high symmetry, which is manifested in that the radius, thickness, density, and Young’s modulus of the shell are highly consistent in the circumferential direction, while silicon The accuracy of the base surface processing technology is within 10 -2 -10 -4 , so it is necessary to further improve the processing technology to improve the symmetry of the hemispherical shell, and at the same time improve the design to reduce the sensitivity of the hemispherical resonator gyroscope to high symmetry
The difficulty of the second type of technology lies in the processing technology of amorphous materials, such as the release of structures after high temperature treatment of amorphous materials, metallization
In addition, the integrated preparation or assembly of electrodes and vacuum packaging are difficulties in design and preparation.

Method used

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  • Shell resonator with impact resistance
  • Shell resonator with impact resistance
  • Shell resonator with impact resistance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Such as Figure 1a-Figure 1e As shown, the shell resonator with shock resistance provided by this example includes:

[0041] A hemispherical harmonic oscillator;

[0042] a substrate for packaging and vertical interconnection;

[0043] Multiple non-planar electrodes embedded in the substrate;

[0044] A glass encapsulation cover for vacuum encapsulation;

[0045] Wherein, the hemispherical resonator is composed of a housing 1 and a self-aligning column 2 located at the inner central axis of the housing 1, and the inner surface of the housing 1 and the surface of the self-aligning column 2 are coated with a layer of conductive layer 6; The self-aligned posts 2 are inserted into the package and vertically interconnected substrates, and connected to the lead-out structure E4 through a layer of conductive wrapping layer 4; the packaged and vertically interconnected substrates are embedded with a plurality of non-planar electrodes, including Drive detection electrode E2 a...

Embodiment 2

[0057] Such as Figure 2a-Figure 2e As shown, the shell resonator with shock resistance provided by this example includes:

[0058] A hemispherical harmonic oscillator;

[0059] a substrate for packaging and vertical interconnection;

[0060] Multiple non-planar electrodes embedded in the substrate;

[0061] A glass encapsulation cover for vacuum encapsulation;

[0062] Wherein, the hemispherical resonator is composed of a shell 1, a rim 5 and a self-aligning pillar 2 located at the inner central axis of the shell 1, and the inner surface of the shell 1 and the surface of the self-aligning pillar 2 are coated with a layer of conductive Layer 6; the self-aligned pillars 2 are inserted into the substrate of the package and vertical interconnection, and connected to the lead-out structure E4 through a layer of conductive wrapping layer 4; the substrate of the package and vertical interconnection is embedded with a plurality of non-planar electrodes , including drive detection...

Embodiment 3

[0075] Such as Figure 3a-Figure 3c As shown, the shell resonator with shock resistance provided by this example includes:

[0076] A hemispherical harmonic oscillator;

[0077] a substrate for packaging and vertical interconnection;

[0078] Multiple non-planar electrodes embedded in the substrate;

[0079] A glass encapsulation cover for vacuum encapsulation;

[0080] Wherein, the hemispherical resonator is composed of a housing 1 and a self-aligning column 2 located at the inner central axis of the housing 1, and the inner surface of the housing 1 and the surface of the self-aligning column 2 are coated with a conductive layer 6; The self-aligned pillars 2 are inserted into the substrate of the packaging and vertical interconnection, and connected to the lead-out structure E4 through a layer of conductive wrapping layer 4; the substrate of the packaging and vertical interconnection is embedded with a plurality of non-planar electrodes, including driving The detection el...

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Abstract

The invention discloses a shell resonator with impact resistance. The shell resonator comprises a hemispherical resonator body, a substrate for packaging and vertical interconnection, a plurality of non-planar electrodes embedded in the substrate, and a glass packaging shell cover for vacuum packaging. The hemispherical resonator body is composed of a shell body and a self-aligning column located at the central axis in the shell body. The inner surface of the hemispherical resonator body is coated with a conductive layer, and the conductive layer is connected with a lead-out structure for leading-out through a conductive wrapping layer. The non-planar electrodes are embedded in the substrate. The lead-out structure and the non-planar electrodes conduct leading-out on the back face of the substrate through a lead of a conductive lead-out layer. Vacuum packaging is achieved for the substrate and the glass packaging shell cover through bonding. The diameter of the hemispherical resonator body is 1-30 mm. The vacuum packaging and vertical interconnection of the shell resonator can be achieved, and meanwhile the environment robustness and impact resistance are improved.

Description

technical field [0001] The invention relates to a vibration resonator, in particular to a shell resonator with impact resistance. Background technique [0002] The invention patent "Microglass hemispherical resonator gyroscope and its wafer-level preparation method" (patent application number: 201510963681.6) proposes a microglass hemispherical resonator with high aspect ratio prepared by thermal foaming process. The patent application of this invention can be regarded as The continuation and expansion of the invention patent "Microglass Hemispherical Resonant Gyroscope and Its Wafer-Level Manufacturing Method". [0003] Micro-hemispheric resonant gyroscope is expected to achieve inertial-level performance due to its special structure and excellent characteristics. At present, many units are developing micro-hemispherical resonant gyroscopes, using novel three-dimensional preparation technology or silicon-based surface processing technology to realize the miniaturization an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C19/56
CPCG01C19/56
Inventor 尚金堂罗斌张瑾
Owner SOUTHEAST UNIV
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