Anisotropic conductive adhesive, method for producing connector, and method for connecting electronic components
A conductive adhesive, anisotropic technology, used in conductive adhesives, semiconductor/solid-state device parts, bonding methods, etc., can solve problems such as display spots or poor connection of IC115 for liquid crystal driving, and achieve good connection. sexual effect
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Embodiment 1
[0101] In Example 1, as the binder resin layer of the anisotropic conductive film, a layer formed by preparing a resin solution obtained by mixing the following substances, applying the resin solution on a PET film, drying, and molding In the form of a film with a thickness of 20 μm,
[0102] Phenoxy resin (YP-70: manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.); 20 parts by mass
[0103] Liquid epoxy resin (EP828: manufactured by Mitsubishi Chemical Corporation); 30 parts by mass
[0104] Solid epoxy resin (YD014: manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.); 20 parts by mass
[0105] Conductive particles (AUL704: manufactured by Sekisui Chemical Industry Co., Ltd.); 30 parts by mass
[0106] Photocationic polymerization initiator (SP-170: manufactured by ADEKA Corporation); 5 parts by mass
[0107] Light absorber (LA-36: manufactured by ADEKA Corporation); 5 parts by mass.
[0108] The absorption peak wavelength of the photocationic polymer...
Embodiment 2
[0111] In Example 2, 5 parts by mass of a light absorber (LA-31: manufactured by ADEKA Corporation) was blended in the adhesive resin layer, except that it was blended in the same manner as in Example 1, and the thus obtained Anisotropic conductive film.
[0112] The absorption peak wavelength of the photocationic polymerization initiator (SP-170) was about 310 nm, and the absorption peak wavelength of the light absorber (LA-31) was 345 nm, and the difference was 35 nm.
[0113] The pressing conditions of the crimping tool and the irradiation time of the ultraviolet irradiator were the same as in Example 1.
Embodiment 3
[0115] In Example 3, 5 parts by mass of a photoradical polymerization initiator (OXE1: manufactured by BASF Corporation) was blended in the adhesive resin layer as a light absorber, except that it was blended in the same manner as in Example 1, The anisotropic conductive film thus obtained was used.
[0116] The absorption peak wavelength of the photocationic polymerization initiator (SP-170) was about 310 nm, and the absorption peak wavelength of the light absorber (OXE01) was 330 nm, and the difference was 20 nm.
[0117] The pressing conditions of the crimping tool and the irradiation time of the ultraviolet irradiator were the same as in Example 1.
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