Silicone material for LED packaging

A technology of LED encapsulation and organic silicon, which is applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low light extraction efficiency of chips, achieve uniform microstructure of resin, excellent UV aging resistance, increase light transmittance and hardness Effect

Pending Publication Date: 2016-11-02
西安亚岱新能源科技有限公司
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

Therefore, for power LEDs to be more widely used, the key is to increase their luminous efficiency and luminous flux to the level of existing lighting sources, and the biggest obstacle for power LEDs to obtain high luminous flux is still the low light extraction efficiency of the chip.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0011] Silicone materials for LED packaging, including: A component and B component.

[0012] Component A includes vinyl silicon polymer, olefin-containing polyphenylene phenylene oxide silicone oil and a curing catalyst mixture; wherein the vinyl silicon polymer includes vinyl silicone resin and vinyl-containing polysiloxane; The ratio of the number of Si-C to Si-O in the main chain structure of polyphenylene phenylene ether ethylene silicone oil containing olefin group is 1:1; the particle size of the phosphor used is 6um.

[0013] The B component includes olefin-based hydrogen polyphenylene oxide, vinyl hydrogen-based silicone resin, inhibitor and phosphor. The inhibitor used was methylethynyl alcohol.

[0014] The ratio of vinyl groups to hydrogen groups in components A and B is 1:1.2.

[0015] This embodiment effectively improves the light transmittance and hardness of the crosslinked resin. Moreover, the cured product contains high phenyl content, so it has the charac...

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Abstract

Silicone materials for LED packaging, including: A component and B component, A component includes vinyl silicon polymer, polyphenylene phenylene ether silicone oil containing olefin group and curing catalyst mixture; B component includes olefin group Hydrogen polyphenylene phenylene ether, vinyl hydrogen silicone, inhibitors and phosphors. In the present invention, through the alternate feeding sequence of low-functionality siloxane and high-functionality siloxane, the phenyl group in the resin is uniformly distributed and the microscopic structure of the resin is uniform, and the light transmittance and hardness of the crosslinked resin are effectively improved. Moreover, the cured product contains high phenyl content, so it has the characteristics of high refractive index, high transparency, excellent resistance to ultraviolet aging and thermal aging, and is an ideal packaging material for power LEDs.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to organic silicon materials for LED packaging. Background technique [0002] In recent years, LED technology and market at home and abroad have developed rapidly. Among them, the luminous efficiency of LED has increased by 100 times, and the cost has dropped by 10 times. Backlight, car combination taillights and interior lighting, etc. [0003] Semiconductor LEDs are used as lighting sources, and the luminous flux of conventional products is far from that of general-purpose light sources such as incandescent lamps and fluorescent lamps. Therefore, for power LEDs to be more widely used, the key is to increase their luminous efficiency and luminous flux to the level of existing lighting sources, and the biggest obstacle for power LEDs to obtain high luminous flux is still the low light extraction efficiency of the chip. At present, the packaging technology of power LEDs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/12C08L83/05H01L33/56
Inventor 韩英
Owner 西安亚岱新能源科技有限公司
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