Copper-clad plate resin glue solution, and method for producing copper-clad plate by using resin glue solution

Abstract

The invention discloses a copper-clad plate resin glue solution. The copper-clad plate resin glue solution is prepared from, by weight, 50-80 parts of polyphenyl ether, 10-20 parts of a styrene monomer and polymer, 60-100 parts of epoxy resin, 1-3 parts of a free radical initiator, 1-20 parts of a cross-linking curing agent, 1-3 parts of a cross-linking curing accelerator and 50-80 parts of a heat conduction filler. The copper-clad plate resin glue solution has the advantages of high Tg value, low dielectric constant and low medium loss, and an insulating layer has a good heat transfer effect. The invention also provides a method for producing a copper-clad plate by using the resin glue solution.

Description

【Technical field】 [0001] The invention relates to a copper-clad laminate resin glue and a method for preparing a copper-clad laminate using the resin glue. 【Background technique】 [0002] At present, the electronics industry is developing rapidly, and the requirements for the performance of copper clad laminates are getting higher and higher, and the factors that can directly affect the performance of the above products are basically attributed to the dielectric constant (Dk) and dielectric loss tangent (Df) of the substrate. , in order to increase the signal transmission speed to the level required to accelerate information processing, the effective way is to reduce the dielectric constant of the material used, in order to reduce the transmission loss, the effective way is to use materials with lower dielectric loss factor, PCB circuit board The substrate material on the board must have both physical and chemical properties, especially insulation and heat dissipation. There...

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Problems solved by technology

[0002] At present, the electronics industry is developing rapidly, and the requirements for the performance of copper clad laminates are getting higher and higher, and the factors that can directly affect the performance of the above products are basically attributed to the dielectric constant (Dk) and dielectric loss tangent (Df) of the substrate. , in order to increase the signal transmission speed to the level required to accelerate information processing, the effective way is to reduce the dielectric constant of the material used, in order to reduce the transmission loss, the effective way is to use materials with lower dielectric loss factor, PCB circuit board The substrate material on the board must have both physical and chemical properties, especially insulation and heat dissipation. Therefore, special material substrates are more widely used on PCB circuit boards. Polyphenylene ether resin is suitable for circuit boards in high-frequency electronic equipment. Material, because polyphenylene ether resin has good high-frequency characteristics, such as low dielectric constant, low dielectric loss, etc., but a disadvantage of polyphenylene ether resin is that it has high melting, resulting in processing defects such as Pores, etc., resulting in unreliable quality of the circuit board

[0003] The commonly used polytetrafluoroethylene has the best dielectric constant and dielectric loss factor, but the forming lamination temperature required to make copper clad laminates needs to be above 350°C, which requires high equipment, and due to the polytetrafluoroethylene material Due to its hydrophobicity and low polarity, the hole metallization of printed boards is different from conventional printed boards, and it is very difficult to metallize and plate holes on it.

For the hole metallization of PTFE high-frequency printed circuit boards, it is necessary to use highly oxidizing and corrosive solutions such as tetrahydrofuran, strong acid and strong alkali, etc. for pre-activation treatment before electroless copper deposition. There are complex processes, Unfavorable factors such as bad smell and serious environmental pollution

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